Gerald S. Leatherman

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Landing structure for through-silicon via
- Patent number 8,933,564
- Issue date Jan 13, 2015
- Intel Corporation
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die having CMOS ring oscillator thereon and method...
- Patent number 7,889,013
- Issue date Feb 15, 2011
- Intel Corporation
- Gerald S. Leatherman
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LANDING STRUCTURE FOR THROUGH-SILICON VIA
- Publication number 20150137368
- Publication date May 21, 2015
- Intel Corporation
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE MONITOR STRUCTURE FOR THROUGH-SILICON VIA (TSV) ARRAYS
- Publication number 20140191410
- Publication date Jul 10, 2014
- Gerald S. Leatherman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING STRUCTURE FOR THROUGH-SILICON VIA
- Publication number 20140175651
- Publication date Jun 26, 2014
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Die Having CMOS Ring Oscillator Thereon And Method...
- Publication number 20090058540
- Publication date Mar 5, 2009
- Gerald S. Leatherman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Copper bump barrier cap to reduce electrical resistance
- Publication number 20070045833
- Publication date Mar 1, 2007
- Ting Zhong
- H01 - BASIC ELECTRIC ELEMENTS