Gerard Stephen Moloney

Person

Sacramento, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically adjustable chemical mechanical polishing head and method...
- Patent number 7,326,103
- Issue date Feb 5, 2008
- Ebara Technologies Incorporated
- Kunihiko Sakurai
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for removing a CMP polishing pad from a platen
- Patent number 7,125,326
- Issue date Oct 24, 2006
- Ebara Technologies Incorporated
- Cormac Walsh
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, retaining ring for use therewith and method fo poli...
- Patent number 7,118,456
- Issue date Oct 10, 2006
- Multiplanar Technologies Incorporated
- Gerard S. Moloney
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing and pad dressing method
- Patent number 7,004,822
- Issue date Feb 28, 2006
- Ebara Technologies, Inc.
- Gerard Stephen Moloney
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for CMP having multi-pressure zone loading for im...
- Patent number 6,966,822
- Issue date Nov 22, 2005
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus having a stepped retaining...
- Patent number 6,916,226
- Issue date Jul 12, 2005
- Ebara Technologies, Inc.
- Gerard Stephen Moloney
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method having a retaini...
- Patent number 6,893,327
- Issue date May 17, 2005
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry distributor for chemical mechanical polishing apparatus and...
- Patent number 6,887,132
- Issue date May 3, 2005
- Multi Planar Technologies Incorporated
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus having edge, center and ann...
- Patent number 6,641,461
- Issue date Nov 4, 2003
- Multi Planar Technologyies, Inc.
- Huey-Ming Wang
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for CMP head having multi-pressure annular zone s...
- Patent number 6,623,343
- Issue date Sep 23, 2003
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for CMP having multi-pressure zone loading for im...
- Patent number 6,558,232
- Issue date May 6, 2003
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method having a soft ba...
- Patent number 6,527,625
- Issue date Mar 4, 2003
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for pneumatic diaphragm CMP head having separate...
- Patent number 6,506,105
- Issue date Jan 14, 2003
- Multi-Planar Technologies, Inc.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing head having floating wafer retaining...
- Patent number 6,309,290
- Issue date Oct 30, 2001
- Mitsubishi Materials Corporation
- Huey-Ming Wang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Ethylene terephthalate polymer retaining ring for a chemical mechan...
- Publication number 20080051011
- Publication date Feb 28, 2008
- Gerard Stephen Moloney
- B24 - GRINDING POLISHING
Information Patent Application
System and method for CMP having multi-pressure zone loading for im...
- Publication number 20060105685
- Publication date May 18, 2006
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR REMOVING A CMP POLISHING PAD FROM A PLATEN
- Publication number 20050277368
- Publication date Dec 15, 2005
- Ebara Technologies Incorporated
- Cormac Walsh
- B24 - GRINDING POLISHING
Information Patent Application
Slurry distributor for chemical mechanical polishing apparatus and...
- Publication number 20050130566
- Publication date Jun 16, 2005
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
Vertically adjustable chemical mechanical polishing head having a p...
- Publication number 20040121704
- Publication date Jun 24, 2004
- Ebara Technologies Incorporated
- Kunihiko Sakurai
- B24 - GRINDING POLISHING
Information Patent Application
Method and polishing pad design enabling improved wafer removal fro...
- Publication number 20040108063
- Publication date Jun 10, 2004
- Ebara Technologies
- Alejandro Reyes
- B24 - GRINDING POLISHING
Information Patent Application
System and method for CMP having multi-pressure zone loading for im...
- Publication number 20040029503
- Publication date Feb 12, 2004
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing and pad dressing method
- Publication number 20040023602
- Publication date Feb 5, 2004
- Ebara Technologies Incorporated
- Gerard Stephen Moloney
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus having a stepped retaining...
- Publication number 20030224703
- Publication date Dec 4, 2003
- Ebara Technologies, Inc.
- Gerard Stephen Moloney
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus and method having a retaini...
- Publication number 20030171076
- Publication date Sep 11, 2003
- Gerard S. Moloney
- B24 - GRINDING POLISHING
Information Patent Application
Slurry distributor for chemical mechanical polishing apparatus and...
- Publication number 20030068959
- Publication date Apr 10, 2003
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus and method having a retaini...
- Publication number 20020182867
- Publication date Dec 5, 2002
- MULTI PLANAR TECHNOLOGIES, INC.
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing apparatus having edge, center and ann...
- Publication number 20020173240
- Publication date Nov 21, 2002
- Huey-Ming Wang
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing head assembly having floating wafer c...
- Publication number 20020173242
- Publication date Nov 21, 2002
- MITSUBISHI MATERIALS CORPORATION
- Huey-Ming Wang
- B24 - GRINDING POLISHING
Information Patent Application
System and method for CMP head having multi-pressure annular zone s...
- Publication number 20020115397
- Publication date Aug 22, 2002
- Jiro Kajiwara
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing head assembly having floating wafer c...
- Publication number 20010007810
- Publication date Jul 12, 2001
- MITSUBISHI MATERIALS CORPORATION
- Gerard S. Moloney
- B24 - GRINDING POLISHING

Gerard Stephen Moloney

Person

Patents Grantslast 30 patents

Vertically adjustable chemical mechanical polishing head and method...

Apparatus and method for removing a CMP polishing pad from a platen

Polishing head, retaining ring for use therewith and method fo poli...

Chemical mechanical polishing and pad dressing method

System and method for CMP having multi-pressure zone loading for im...

Chemical mechanical polishing apparatus having a stepped retaining...

Chemical mechanical polishing apparatus and method having a retaini...

Slurry distributor for chemical mechanical polishing apparatus and...

Chemical mechanical polishing apparatus having edge, center and ann...

System and method for CMP head having multi-pressure annular zone s...

System and method for CMP having multi-pressure zone loading for im...

Chemical mechanical polishing apparatus and method having a soft ba...

System and method for pneumatic diaphragm CMP head having separate...

Chemical mechanical polishing head having floating wafer retaining...

Patents Applicationslast 30 patents

Ethylene terephthalate polymer retaining ring for a chemical mechan...

System and method for CMP having multi-pressure zone loading for im...

APPARATUS AND METHOD FOR REMOVING A CMP POLISHING PAD FROM A PLATEN

Slurry distributor for chemical mechanical polishing apparatus and...

Vertically adjustable chemical mechanical polishing head having a p...

Method and polishing pad design enabling improved wafer removal fro...

System and method for CMP having multi-pressure zone loading for im...

Chemical mechanical polishing and pad dressing method

Chemical mechanical polishing apparatus having a stepped retaining...

Chemical mechanical polishing apparatus and method having a retaini...

Slurry distributor for chemical mechanical polishing apparatus and...

Chemical mechanical polishing apparatus and method having a retaini...

Chemical mechanical polishing apparatus having edge, center and ann...

Chemical mechanical polishing head assembly having floating wafer c...

System and method for CMP head having multi-pressure annular zone s...

Chemical mechanical polishing head assembly having floating wafer c...