Gerard Wisniewski

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Gdansk, PL

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Patents Grantslast 30 patents

Information Patent Grant
Stacked multiple connection module
- Patent number 7,172,432
- Issue date Feb 6, 2007
- Intel Corporation
- Edoardo Campini
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus interconnecting circuit board and mezzanine card or cards
- Patent number 6,805,560
- Issue date Oct 19, 2004
- Intel Corporation
- Jacek Budny
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package
- Patent number 6,791,832
- Issue date Sep 14, 2004
- Intel Corporation
- Jacek Budny
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked multiple connection module
- Publication number 20060223343
- Publication date Oct 5, 2006
- Edoardo Campini
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Apparatus inteconnecting circuit board and mezzanine card or cards
- Publication number 20050186807
- Publication date Aug 25, 2005
- Jacek Budny
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Co-processing
- Publication number 20050114627
- Publication date May 26, 2005
- Jacek Budny
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus interconnecting circuit board and mezzanine card or cards
- Publication number 20050048805
- Publication date Mar 3, 2005
- Jacek Budny
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package
- Publication number 20030184966
- Publication date Oct 2, 2003
- Intel Corporation
- Jacek Budny
- H01 - BASIC ELECTRIC ELEMENTS