Gerd Schlottig

Person

Uitikon, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disconnect assembly for active cooling of packaged electronics
- Patent number 10,767,939
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Sealing arrangement
- Patent number 10,763,189
- Issue date Sep 1, 2020
- International Business Machines Corporation
- Ingmar G. Meijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,158
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,727,159
- Issue date Jul 28, 2020
- International Business Machines Corporatin
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal element with thermal expansion coefficient mismatch
- Patent number 10,551,132
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 10,529,648
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disconnect assembly for active cooling of packaged electronics
- Patent number 10,527,365
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High-performance compliant heat-exchanger comprising vapor chamber
- Patent number 10,388,540
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant heat sink
- Patent number 10,157,814
- Issue date Dec 18, 2018
- International Business Machines Corporation
- Gerhard I. Meijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,153,250
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,132,433
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,107,426
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Releasable, threadless conduit connector for liquid manifold
- Patent number 10,006,571
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Counter-flow expanding channels for enhanced two-phase heat removal
- Patent number 9,941,189
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device with nested chambers for computer hardware
- Patent number 9,880,595
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical assembly with optical coupler
- Patent number 9,864,152
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Antonio La Porta
- G02 - OPTICS
Information Patent Grant
Substrate device and electric circuit arrangement having first subs...
- Patent number 9,698,089
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device and electric circuit arrangement having first subs...
- Patent number 9,433,077
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a filled cavity between a first and a seco...
- Patent number 9,230,832
- Issue date Jan 5, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disassemblable electronic assembly with leak-inhibiting coolant cap...
- Patent number 9,066,460
- Issue date Jun 23, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing an underfill in a semiconductor chip package
- Patent number 8,907,503
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Estimating a Consumed Lifetime of an Energy Storage Device
- Publication number 20250020736
- Publication date Jan 16, 2025
- ABB Schweiz AG
- Lorenzo Privitera
- G01 - MEASURING TESTING
Information Patent Application
Method to Detect a Size Change in an Energy Storage Device
- Publication number 20240384976
- Publication date Nov 21, 2024
- ABB Schweiz AG
- Gerd Schlottig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGNOSIS AND PROGNOSIS OF IGBT MODULES
- Publication number 20240118333
- Publication date Apr 11, 2024
- ABB Schweiz AG
- Aleksi Vulli
- G01 - MEASURING TESTING
Information Patent Application
Power Semiconductor Module with Accessible Metal Clips
- Publication number 20230048878
- Publication date Feb 16, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OF FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HE...
- Publication number 20200357774
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200118907
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20200091037
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS
- Publication number 20200072562
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS
- Publication number 20200011617
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT REMOVAL ELEMENT WITH THERMAL EXPANSION COEFFICIENT MISMATCH
- Publication number 20190162484
- Publication date May 30, 2019
- International Business Machines Corporation
- Gerd Schlottig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20190043838
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT HEAT SINK
- Publication number 20180374771
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Gerhard I. Meijer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber
- Publication number 20180261522
- Publication date Sep 13, 2018
- International Business Machines Corporation
- Thomas Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20180182686
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD
- Publication number 20180149294
- Publication date May 31, 2018
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE WITH NESTED CHAMBERS FOR COMPUTER HARDWARE
- Publication number 20170357297
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Thomas BRUNSCHWILER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POROUS UNDERFILL ENABLING REWORK
- Publication number 20170200659
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Michael Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
- Publication number 20170179001
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT
- Publication number 20160351485
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20160307874
- Publication date Oct 20, 2016
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING ARRANGEMENT
- Publication number 20160061365
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Ingmar G. Meijer
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD
- Publication number 20160061364
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD
- Publication number 20160059367
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A FILLED CAVITY BETWEEN A FIRST AND A SECO...
- Publication number 20150249022
- Publication date Sep 3, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT
- Publication number 20150237729
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAP...
- Publication number 20140198452
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-CO...
- Publication number 20140078672
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Thomas J. BRUNSCHWILER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING AN UNDERFILL IN A SEMICONDUCTOR CHIP PACKAGE
- Publication number 20140027932
- Publication date Jan 30, 2014
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS

Gerd Schlottig

Person

Patents Grantslast 30 patents

Manufacturing of flip-chip electronic device with carrier having he...

Flip-chip electronic device with carrier having heat dissipation el...

Disconnect assembly for active cooling of packaged electronics

Sealing arrangement

Counter-flow expanding channels for enhanced two-phase heat removal

Counter-flow expanding channels for enhanced two-phase heat removal

Heat removal element with thermal expansion coefficient mismatch

Counter-flow expanding channels for enhanced two-phase heat removal

Disconnect assembly for active cooling of packaged electronics

High-performance compliant heat-exchanger comprising vapor chamber

Compliant heat sink

Flip-chip electronic device with carrier having heat dissipation el...

Releasable, threadless conduit connector for liquid manifold

Releasable, threadless conduit connector for liquid manifold

Releasable, threadless conduit connector for liquid manifold

Counter-flow expanding channels for enhanced two-phase heat removal

Cooling device with nested chambers for computer hardware

Optical assembly with optical coupler

Substrate device and electric circuit arrangement having first subs...

Substrate device and electric circuit arrangement having first subs...

Method for manufacturing a filled cavity between a first and a seco...

Disassemblable electronic assembly with leak-inhibiting coolant cap...

Manufacturing an underfill in a semiconductor chip package

Patents Applicationslast 30 patents

Method for Estimating a Consumed Lifetime of an Energy Storage Device

Method to Detect a Size Change in an Energy Storage Device

DIAGNOSIS AND PROGNOSIS OF IGBT MODULES

Power Semiconductor Module with Accessible Metal Clips

MANUFACTURING OF FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HE...

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

HEAT REMOVAL ELEMENT WITH THERMAL EXPANSION COEFFICIENT MISMATCH

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

COMPLIANT HEAT SINK

High-Performance Compliant Heat-Exchanger Comprising Vapor Chamber

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD

COOLING DEVICE WITH NESTED CHAMBERS FOR COMPUTER HARDWARE

POROUS UNDERFILL ENABLING REWORK

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL

SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

SEALING ARRANGEMENT

RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD

RELEASABLE, THREADLESS CONDUIT CONNECTOR FOR LIQUID MANIFOLD

METHOD FOR MANUFACTURING A FILLED CAVITY BETWEEN A FIRST AND A SECO...

SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT

DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAP...

ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-CO...

MANUFACTURING AN UNDERFILL IN A SEMICONDUCTOR CHIP PACKAGE