Gerhard Deml

Follow

Person

Erding, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device having a resin with wa...
- Patent number 8,377,753
- Issue date Feb 19, 2013
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including isolation layer
- Patent number 8,110,906
- Issue date Feb 7, 2012
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a resin with warpage compensated surfaces
- Patent number 8,067,841
- Issue date Nov 29, 2011
- Infineon Technologies AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for a switched-mode power supply and method fo...
- Patent number 7,923,827
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Fabricating A Semiconductor Device Having A Resin With Wa...
- Publication number 20120058606
- Publication date Mar 8, 2012
- INFINEON TECHNOLOGIES AG
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090212446
- Publication date Aug 27, 2009
- Chai Wei Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module for a Switched-Mode Power Supply and Method fo...
- Publication number 20090001535
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER
- Publication number 20080173992
- Publication date Jul 24, 2008
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS