Gerhard Koops

Person

Kessel-Lo, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a device with a cavity
- Patent number 10,171,007
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-device with a cavity
- Patent number 9,859,818
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Field plate assisted resistance reduction in a semiconductor device
- Patent number 9,142,625
- Issue date Sep 22, 2015
- NXP B.V.
- Anco Heringa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezo-resistive MEMS resonator
- Patent number 9,017,561
- Issue date Apr 28, 2015
- NXP, B.V.
- Gerhard Koops
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
MEMS devices
- Patent number 8,980,698
- Issue date Mar 17, 2015
- NXP, B.V.
- Greja Johanna Adriana Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interface for communication between voltage domains
- Patent number 8,818,265
- Issue date Aug 26, 2014
- NXP B.V.
- Peter Gerard Steeneken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sealing structure and method of manufacturing the same
- Patent number 8,592,228
- Issue date Nov 26, 2013
- NXP, B.V.
- Johannes Donkers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezo-resistive MEMS resonator
- Patent number 8,569,934
- Issue date Oct 29, 2013
- NXP B.V.
- Gerhard Koops
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Device with microstructure and method of forming such a device
- Patent number 8,426,928
- Issue date Apr 23, 2013
- NXP B.V.
- Johannes van Wingerden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscopic structure packaging method and device with packaged mic...
- Patent number 8,330,238
- Issue date Dec 11, 2012
- NXP B.V.
- Johannes van Wingerden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a device with a cavity
- Patent number 8,310,053
- Issue date Nov 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscopic structure packaging method and device with packaged mic...
- Patent number 8,273,653
- Issue date Sep 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optocoupler circuit
- Patent number 8,260,098
- Issue date Sep 4, 2012
- NXP B.V.
- Dusan Golubovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS resonator
- Patent number 8,143,971
- Issue date Mar 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jozef Thomas Beek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing a Device with a Cavity
- Publication number 20180109203
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A DEVICE WITH A CAVITY
- Publication number 20150091411
- Publication date Apr 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MIM-CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20140145297
- Publication date May 29, 2014
- NXP B.V.
- Roel DAAMEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD PLATE ASSISTED RESISTANCE REDUCTION IN A SEMICONDUCTOR DEVICE
- Publication number 20140103968
- Publication date Apr 17, 2014
- NXP B.V.
- ANCO HERINGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZO-RESISTIVE MEMS RESONATOR
- Publication number 20140001147
- Publication date Jan 2, 2014
- NXP B.V.
- Gerhard Koops
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE FOR COMMUNICATION BETWEEN VOLTAGE DOMAINS
- Publication number 20130281033
- Publication date Oct 24, 2013
- Peter Gerard Steeneken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of Manufacturing a Device with a Cavity
- Publication number 20130069178
- Publication date Mar 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Optocoupler Circuit
- Publication number 20120213466
- Publication date Aug 23, 2012
- Dusan Golubovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICES
- Publication number 20110210435
- Publication date Sep 1, 2011
- NXP B.V.
- Greja Johanna Adriana Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE WITH MICROSTRUCTURE AND METHOD OF FORMING SUCH A DEVICE
- Publication number 20110186941
- Publication date Aug 4, 2011
- NXP B.V.
- Johannes van WINGERDEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZO-RESISTIVE MEMS RESONATOR
- Publication number 20110181153
- Publication date Jul 28, 2011
- NXP B.V.
- Gerhard KOOPS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MIC...
- Publication number 20110175178
- Publication date Jul 21, 2011
- NXP B.V.
- Johannes van WINGERDEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POWER SEMICONDUCTOR DEVICE STRUCTURE FOR INTEGRATED CIRCUIT AND MET...
- Publication number 20100244125
- Publication date Sep 30, 2010
- NXP B.V.
- Jan Sonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100052081
- Publication date Mar 4, 2010
- NXP, B.V.
- Johannes Donkers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS RESONATOR
- Publication number 20100026421
- Publication date Feb 4, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jozef Thomas BEEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MIC...
- Publication number 20100006957
- Publication date Jan 14, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria VERHEIJDEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A DEVICE WITH A CAVITY
- Publication number 20090267166
- Publication date Oct 29, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Greja Johanna Adriana Maria Verheijden
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Gerhard Koops

Person

Patents Grantslast 30 patents

Method of manufacturing a device with a cavity

Micro-device with a cavity

Field plate assisted resistance reduction in a semiconductor device

Piezo-resistive MEMS resonator

MEMS devices

Interface for communication between voltage domains

Sealing structure and method of manufacturing the same

Piezo-resistive MEMS resonator

Device with microstructure and method of forming such a device

Microscopic structure packaging method and device with packaged mic...

Method of manufacturing a device with a cavity

Microscopic structure packaging method and device with packaged mic...

Optocoupler circuit

MEMS resonator

Patents Applicationslast 30 patents

Method of Manufacturing a Device with a Cavity

METHOD OF MANUFACTURING A DEVICE WITH A CAVITY

MIM-CAPACITOR AND METHOD OF MANUFACTURING SAME

FIELD PLATE ASSISTED RESISTANCE REDUCTION IN A SEMICONDUCTOR DEVICE

PIEZO-RESISTIVE MEMS RESONATOR

INTERFACE FOR COMMUNICATION BETWEEN VOLTAGE DOMAINS

Method of Manufacturing a Device with a Cavity

Optocoupler Circuit

MEMS DEVICES

DEVICE WITH MICROSTRUCTURE AND METHOD OF FORMING SUCH A DEVICE

PIEZO-RESISTIVE MEMS RESONATOR

MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MIC...

POWER SEMICONDUCTOR DEVICE STRUCTURE FOR INTEGRATED CIRCUIT AND MET...

A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MEMS RESONATOR

MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MIC...

METHOD OF MANUFACTURING A DEVICE WITH A CAVITY