Gerhard Schoor

Person

Dettenhausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 8,929,086
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for structural enhancement of compression system board conne...
- Patent number 7,930,820
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gel package structural enhancement of compression system board conn...
- Patent number 7,543,373
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for using gel package structure enhancing thermal dissipatio...
- Patent number 7,344,919
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Multi-Chip Module (MCM) of a Computer System
- Publication number 20080089024
- Publication date Apr 17, 2008
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069358
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072450
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069754
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070072344
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gel package structural enhancement of compression system board conn...
- Publication number 20070069753
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael F. McAllister
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Gerhard Schoor

Person

Patents Grantslast 30 patents

Gel package structural enhancement of compression system board conn...

Method for structural enhancement of compression system board conne...

Gel package structural enhancement of compression system board conn...

Method for using gel package structure enhancing thermal dissipatio...

Patents Applicationslast 30 patents

Multi-Chip Module (MCM) of a Computer System

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...

Gel package structural enhancement of compression system board conn...