Gernot Biese

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Marzling, DE

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Patents Grantslast 30 patents

Information Patent Grant
Reduced pattern-induced wafer deformation
- Patent number 11,587,889
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing semiconductor wafers
- Patent number 7,601,549
- Issue date Oct 13, 2009
- Texas Instruments Incorporated
- Gernot Biese
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR REDUCING PATTERN-INDUCED WAFER DEFORMATION
- Publication number 20230170314
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced pattern-induced wafer deformation
- Publication number 20210091013
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Processing Semiconductor Wafers
- Publication number 20080261334
- Publication date Oct 23, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Gernot Biese
- H01 - BASIC ELECTRIC ELEMENTS