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Gerry Balanon
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San Jose, CA, US
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last 30 patents
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Patent Grant
Heat spreader interconnect methodology for thermally enhanced PBGA...
Patent number
6,706,563
Issue date
Mar 16, 2004
ST Assembly Test Services PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having heat sink attached to pre-molded cavit...
Patent number
6,534,859
Issue date
Mar 18, 2003
ST Assembly Test Services Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Heat spreader interconnect methodology for thermally enhanced PBGA...
Publication number
20030197195
Publication date
Oct 23, 2003
ST ASSEMBLY TEST SERVICES PTE LTD
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS