Gerry Balanon

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with heat sink
- Patent number 7,446,408
- Issue date Nov 4, 2008
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader interconnect for thermally enhanced PBGA packages
- Patent number 6,818,981
- Issue date Nov 16, 2004
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PBGA substrate for anchoring heat sink
- Patent number 6,599,779
- Issue date Jul 29, 2003
- ST Assembly Test Service Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat spreader interconnect for thermally enhanced PBGA packages
- Publication number 20040155338
- Publication date Aug 12, 2004
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PBGA substrate for anchoring heat sink
- Publication number 20030216024
- Publication date Nov 20, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PBGA substrate for anchoring heat sink
- Publication number 20030057545
- Publication date Mar 27, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS