Geum Hee Yun

Person

Suwon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor component
- Patent number 10,923,284
- Issue date Feb 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Geum Hee Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and photosensitive resin composition
- Patent number 10,283,426
- Issue date May 7, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer inductor and method for manufacturing the same
- Patent number 9,035,738
- Issue date May 19, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sa Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming substrate, and prepreg and substrate using...
- Patent number 8,101,248
- Issue date Jan 24, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package and manufacturing method thereof
- Patent number 8,043,876
- Issue date Oct 25, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Young Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Parallel multi-layer printed circuit board having improved intercon...
- Patent number 7,279,412
- Issue date Oct 9, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR COMPONENT
- Publication number 20200185153
- Publication date Jun 11, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND CURED PRODUC...
- Publication number 20190121235
- Publication date Apr 25, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Geum-Hee YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SHIELDING RESIN COMPOSITIONS
- Publication number 20180305509
- Publication date Oct 25, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Geum-Hee YUN
- G02 - OPTICS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20180102297
- Publication date Apr 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND P...
- Publication number 20160237303
- Publication date Aug 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Geum-Hee YUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOA...
- Publication number 20150147542
- Publication date May 28, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...
- Publication number 20150114693
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...
- Publication number 20150065608
- Publication date Mar 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...
- Publication number 20150057393
- Publication date Feb 26, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INORGANIC FILLER, AND INSULATING RESIN COMPOSITION, INSULATING FILM...
- Publication number 20150027763
- Publication date Jan 29, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Ho HONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING...
- Publication number 20140367147
- Publication date Dec 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...
- Publication number 20140154479
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140145812
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sa Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, A...
- Publication number 20140076198
- Publication date Mar 20, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Young Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING...
- Publication number 20110121233
- Publication date May 26, 2011
- Geum Hee Yun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Heat Radiation Substrate and Illumination Module Substrate Having H...
- Publication number 20100255742
- Publication date Oct 7, 2010
- Geum Hee YUN
- B32 - LAYERED PRODUCTS
Information Patent Application
Backlight unit using a thermoplastic resin board
- Publication number 20090262520
- Publication date Oct 22, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Joon Park
- G02 - OPTICS
Information Patent Application
Light emitting diode package and manufacturing method thereof
- Publication number 20090189177
- Publication date Jul 30, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Young Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Array light source using led and backlight unit including the same
- Publication number 20090141481
- Publication date Jun 4, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Joon PARK
- G02 - OPTICS
Information Patent Application
Eucryptite ceramic filler and insulating composite material contain...
- Publication number 20080242787
- Publication date Oct 2, 2008
- Samsung Electro-Mechanics CO., LTD.
- Jin-Cheol Kim
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Laminate for printed circuit board and method of manufacturing the...
- Publication number 20060257622
- Publication date Nov 16, 2006
- Samsung Electro-mechanics Co., Ltd.
- Joon Sik Shin
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus and method for manufacturing copper clad laminate with im...
- Publication number 20060124228
- Publication date Jun 15, 2006
- Samsung Electro-mechanics Co., Ltd.
- Sang Youp Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
Parallel multi-layer printed circuit board having improved intercon...
- Publication number 20050085065
- Publication date Apr 21, 2005
- Samsung Electro-Mechanics CO., LTD.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Geum Hee Yun

Person

Patents Grantslast 30 patents

Capacitor component

Fan-out semiconductor package and photosensitive resin composition

Multilayer inductor and method for manufacturing the same

Composition for forming substrate, and prepreg and substrate using...

Light emitting diode package and manufacturing method thereof

Parallel multi-layer printed circuit board having improved intercon...

Patents Applicationslast 30 patents

CAPACITOR COMPONENT

PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND CURED PRODUC...

LIGHT SHIELDING RESIN COMPOSITIONS

FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND P...

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOA...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS...

INORGANIC FILLER, AND INSULATING RESIN COMPOSITION, INSULATING FILM...

INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING...

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...

MULTILAYER INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, A...

COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING...

Heat Radiation Substrate and Illumination Module Substrate Having H...

Backlight unit using a thermoplastic resin board

Light emitting diode package and manufacturing method thereof

Array light source using led and backlight unit including the same

Eucryptite ceramic filler and insulating composite material contain...

Laminate for printed circuit board and method of manufacturing the...

Apparatus and method for manufacturing copper clad laminate with im...

Parallel multi-layer printed circuit board having improved intercon...