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Geun Sik Kim
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Gilbert, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package system
Patent number
8,410,587
Issue date
Apr 2, 2013
Stats Chippac Ltd.
Taesung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
Patent number
8,405,230
Issue date
Mar 26, 2013
Stats Chippac Ltd.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with package stacking and metho...
Patent number
7,785,925
Issue date
Aug 31, 2010
Stats Chippac Ltd.
Geun Sik Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR FLIP CHIP PACKAGE HAVING SUBSTANTIALLY NON-COLLAPSIBL...
Publication number
20110108970
Publication date
May 12, 2011
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
Publication number
20100155918
Publication date
Jun 24, 2010
Geun Sik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
Publication number
20090309198
Publication date
Dec 17, 2009
Taesung Lee
H01 - BASIC ELECTRIC ELEMENTS