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Geun Sik Kim
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Pundong-ku, KR
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor flip chip package having substantially non-collapsibl...
Patent number
7,880,313
Issue date
Feb 1, 2011
ChipPAC, Inc.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having double layer leadframe
Patent number
7,671,451
Issue date
Mar 2, 2010
ChipPAC, Inc.
Jason Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system
Patent number
7,615,851
Issue date
Nov 10, 2009
Stats Chippac Ltd.
Taesung Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor package flip chip interconnect having spacer
Publication number
20060192295
Publication date
Aug 31, 2006
ChipPAC, Inc.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package having double layer leadframe
Publication number
20060192274
Publication date
Aug 31, 2006
ChipPAC, Inc.
Jason Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die with discrete spacers and die spacing method
Publication number
20050224959
Publication date
Oct 13, 2005
ChipPAC, Inc.
Hyeog Chan Kwon
H01 - BASIC ELECTRIC ELEMENTS