GEUNSIK AHN

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip bonding apparatus using VCSEL device
- Patent number 11,810,890
- Issue date Nov 7, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask changing unit for laser bonding apparatus
- Patent number 11,358,236
- Issue date Jun 14, 2022
- PROTEC CO., LTD.
- Geunsik Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for laser bonding of flip chip and method for laser bondi...
- Patent number 10,497,665
- Issue date Dec 3, 2019
- PROTEC CO., LTD.
- Geunsik Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for bonding semiconductor chip and method for bonding sem...
- Patent number 10,483,228
- Issue date Nov 19, 2019
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240332233
- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240314939
- Publication date Sep 19, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING
- Publication number 20240178182
- Publication date May 30, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL
- Publication number 20240009747
- Publication date Jan 11, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR LASER BONDING OF FLIP CHIP
- Publication number 20220052019
- Publication date Feb 17, 2022
- PROTEC CO., LTD.
- YOUN SUNG KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP LASER BONDING SYSTEM
- Publication number 20210335749
- Publication date Oct 28, 2021
- PROTEC CO., LTD.
- GEUNSIK AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE
- Publication number 20210335748
- Publication date Oct 28, 2021
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Changing Unit for Laser Bonding Apparatus
- Publication number 20200215645
- Publication date Jul 9, 2020
- PROTEC CO., LTD.
- GEUNSIK AHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIP AND METHOD FOR BONDING SEM...
- Publication number 20180366433
- Publication date Dec 20, 2018
- PROTEC CO., LTD.
- GEUNSIK AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDI...
- Publication number 20180366435
- Publication date Dec 20, 2018
- PROTEC CO., LTD.
- GEUNSIK AHN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

GEUNSIK AHN

Person

Patents Grantslast 30 patents

Flip-chip bonding apparatus using VCSEL device

Mask changing unit for laser bonding apparatus

Apparatus for laser bonding of flip chip and method for laser bondi...

Apparatus for bonding semiconductor chip and method for bonding sem...

Patents Applicationslast 30 patents

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD OF BONDING COLUMN TYPE DEPOSITS

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

SYSTEM FOR LASER BONDING OF FLIP CHIP

FLIP CHIP LASER BONDING SYSTEM

FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE

Mask Changing Unit for Laser Bonding Apparatus

APPARATUS FOR BONDING SEMICONDUCTOR CHIP AND METHOD FOR BONDING SEM...

APPARATUS FOR LASER BONDING OF FLIP CHIP AND METHOD FOR LASER BONDI...