Gi Jo Jung

Person

Chungcheongbuk-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,276,632
- Issue date Mar 15, 2022
- Nepes Co., Ltd.
- Gi Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package and fabrication method thereof
- Patent number 8,421,211
- Issue date Apr 16, 2013
- Nepes Corporation
- In Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and fabrication method thereof
- Patent number 8,237,276
- Issue date Aug 7, 2012
- Nepes Corporation
- Chi Jung Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 7,952,210
- Issue date May 31, 2011
- Nepes Corporation
- Gi-Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra slim semiconductor package and method of fabricating the same
- Patent number 7,808,095
- Issue date Oct 5, 2010
- Nepes Corporation
- Gi-Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200203265
- Publication date Jun 25, 2020
- NEPES CO., LTD.
- Gi Jo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERPOSER BLOCK THEREIN
- Publication number 20120286419
- Publication date Nov 15, 2012
- NEPES CORPORATION
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20110285015
- Publication date Nov 24, 2011
- NEPES CORPORATION
- Chi Jung Song
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WAFER LEVEL SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110260336
- Publication date Oct 27, 2011
- NEPES CORPORATION
- In Soo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20090146281
- Publication date Jun 11, 2009
- NEPES CORPORATION
- Gi Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SLIM SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20090008762
- Publication date Jan 8, 2009
- NEPES CORPORATION
- Gi Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20080203583
- Publication date Aug 28, 2008
- NEPES CORPORATION
- Gi-Jo Jung
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Wafer level semiconductor package and fabrication method thereof

Bump structure and fabrication method thereof

Semiconductor package and fabrication method thereof

Ultra slim semiconductor package and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH INTERPOSER BLOCK THEREIN

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

WAFER LEVEL SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF

ULTRA SLIM SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF