Gianni SIGNORINI

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Garching bei Muenchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method to implement wafer-level chip-scale packages with grounded c...
- Patent number 12,080,655
- Issue date Sep 3, 2024
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 11,646,288
- Issue date May 9, 2023
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
- Publication number 20240128202
- Publication date Apr 18, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
- Publication number 20240030175
- Publication date Jan 25, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
- Publication number 20230238347
- Publication date Jul 27, 2023
- Intel IP Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING AND ACCESSING PASSIVE COMPONENTS IN WAFER-LEVEL PACKAGES
- Publication number 20210057367
- Publication date Feb 25, 2021
- Intel IP Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
- Publication number 20200312781
- Publication date Oct 1, 2020
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS