Gihwan KIM

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device including vertical memory device
- Patent number 11,963,361
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Changsun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with key pattern and electronic system includi...
- Patent number 11,889,688
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chang-Sun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-fill layers, methods of forming the same, and semiconductor dev...
- Patent number 11,640,922
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Miso Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization method of a capping insulating layer, a method of for...
- Patent number 11,482,448
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Hansol Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-fill layers, methods of forming the same, and semiconductor dev...
- Patent number 11,257,708
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Miso Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE
- Publication number 20240224533
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Changsun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH KEY PATTERN AND ELECTRONIC SYSTEM INCLUDI...
- Publication number 20220181345
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- CHANG-SUN HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL LAYERS, METHODS OF FORMING THE SAME, AND SEMICONDUCTOR DEV...
- Publication number 20220139766
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Miso SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH HIGHLY INTEGRATED MEMORY AND PERIPH...
- Publication number 20220028877
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Changsun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE
- Publication number 20210375905
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Changsun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20210134661
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- HANSOL SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL LAYERS, METHODS OF FORMING THE SAME, AND SEMICONDUCTOR DEV...
- Publication number 20200075398
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Miso SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit device including vertical memory device

Semiconductor device with key pattern and electronic system includi...

Gap-fill layers, methods of forming the same, and semiconductor dev...

Planarization method of a capping insulating layer, a method of for...

Gap-fill layers, methods of forming the same, and semiconductor dev...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE

SEMICONDUCTOR DEVICE WITH KEY PATTERN AND ELECTRONIC SYSTEM INCLUDI...

GAP-FILL LAYERS, METHODS OF FORMING THE SAME, AND SEMICONDUCTOR DEV...

INTEGRATED CIRCUIT DEVICES WITH HIGHLY INTEGRATED MEMORY AND PERIPH...

INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

GAP-FILL LAYERS, METHODS OF FORMING THE SAME, AND SEMICONDUCTOR DEV...