Gil Huang

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Hsinchu Jhubei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming solder bumps of increased height
- Patent number 7,459,386
- Issue date Dec 2, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce UBM undercut
- Patent number 7,456,090
- Issue date Nov 25, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Blenny Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structure for semiconductor structures
- Patent number 7,378,724
- Issue date May 27, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method to reduce UBM undercut
- Publication number 20080157362
- Publication date Jul 3, 2008
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Blenny Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity structure for semiconductor structures
- Publication number 20060213804
- Publication date Sep 28, 2006
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming solder bumps of increased height
- Publication number 20060105560
- Publication date May 18, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsin Tseng
- H01 - BASIC ELECTRIC ELEMENTS