Gil Hwan Son

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including transistor stacks having diffe...
- Patent number 11,923,365
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyuk Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 11,881,455
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING TRANSISTOR STACKS HAVING DIFFE...
- Publication number 20240170486
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- JEONGHYUK YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20240063123
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20220384345
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING TRANSISTOR STACKS HAVING DIFFE...
- Publication number 20220375935
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- JEONGHYUK YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20220157723
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS

Gil Hwan Son

Person

Patents Grantslast 30 patents

Backside power distribution network semiconductor package and metho...

Through silicon buried power rail implemented backside power distri...

Integrated circuit devices including transistor stacks having diffe...

Through silicon buried power rail implemented backside power distri...

Backside power distribution network semiconductor package and metho...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES INCLUDING TRANSISTOR STACKS HAVING DIFFE...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

INTEGRATED CIRCUIT DEVICES INCLUDING TRANSISTOR STACKS HAVING DIFFE...

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...