Gilheyun Choi

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer carrier having cavity
- Patent number 9,583,373
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor devices having through electr...
- Patent number 9,543,200
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon via
- Patent number 9,543,250
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Jin Ho An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 9,362,172
- Issue date Jun 7, 2016
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including stress relief structures
- Patent number 9,214,374
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 9,171,781
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Jang-Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive via structures and methods...
- Patent number 9,171,753
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through silicon via electrodes and...
- Patent number 9,153,559
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having conductive through via electrodes in...
- Patent number 9,153,489
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a non-planar conductive pattern, an...
- Patent number 9,142,489
- Issue date Sep 22, 2015
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 9,076,849
- Issue date Jul 7, 2015
- Samsung Electronics Co., Ltd.
- Jin Ho An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 9,070,748
- Issue date Jun 30, 2015
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 9,053,948
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Kyoung-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 8,941,216
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 8,927,426
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes
- Patent number 8,872,351
- Issue date Oct 28, 2014
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes and methods of fabr...
- Patent number 8,710,650
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and methods of forming the same
- Patent number 8,691,692
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including protected barrier layers
- Patent number 8,564,139
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes and methods of fabr...
- Patent number 8,551,860
- Issue date Oct 8, 2013
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect of semiconductor device
- Patent number 8,319,348
- Issue date Nov 27, 2012
- Samsung Electronics Co., Ltd.
- Jongmyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,258,058
- Issue date Sep 4, 2012
- Samsung Electronic Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,148,261
- Issue date Apr 3, 2012
- Samsung Electronics Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20160064193
- Publication date Mar 3, 2016
- Hogon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TREATING SUBSTRATES
- Publication number 20150343495
- Publication date Dec 3, 2015
- Kyoungseob KIM
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20150270221
- Publication date Sep 24, 2015
- Samsung Electronics Co., Ltd.
- Jin Ho AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20150243637
- Publication date Aug 27, 2015
- Pil-Kyu Kang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20150093896
- Publication date Apr 2, 2015
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20140312456
- Publication date Oct 23, 2014
- Samsung Electronics Co., Ltd.
- Kyoung-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Semiconductor Devices Having Through Electr...
- Publication number 20140235052
- Publication date Aug 21, 2014
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20140225251
- Publication date Aug 14, 2014
- Samsung Electronics Co., Ltd.
- Jang-Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20140179103
- Publication date Jun 26, 2014
- Pil-Kyu Kang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20140162449
- Publication date Jun 12, 2014
- Samsung Electronics Co., LTD
- Jin Ho AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Carrier Having Cavity
- Publication number 20140110894
- Publication date Apr 24, 2014
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...
- Publication number 20140042633
- Publication date Feb 13, 2014
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Through Electrodes and Methods of Fabr...
- Publication number 20140035144
- Publication date Feb 6, 2014
- Samsung Electronics Co., Ltd.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20130344695
- Publication date Dec 26, 2013
- Samsung Electronics Co., Ltd.
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIA STRUCTURES AND METHODS...
- Publication number 20130210222
- Publication date Aug 15, 2013
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Through-Vias and Methods for Fabricati...
- Publication number 20130207242
- Publication date Aug 15, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...
- Publication number 20130200526
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20130175693
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- TAE SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Protected Barrier Layers
- Publication number 20130134603
- Publication date May 30, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...
- Publication number 20130127019
- Publication date May 23, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF FABR...
- Publication number 20130052794
- Publication date Feb 28, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Sukchul Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING THROUGH SILICON VIA STRUCTURES HA...
- Publication number 20130020719
- Publication date Jan 24, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Eun-Ji Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING STRESS RELIEF STRUCTURES
- Publication number 20120292746
- Publication date Nov 22, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING CONDUCTIVE THROUGH VIA ELECTRODES IN...
- Publication number 20120292782
- Publication date Nov 22, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20120164826
- Publication date Jun 28, 2012
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20120119376
- Publication date May 17, 2012
- Dong-Chan Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoelectric Integrated Circuit Devices And Methods Of Forming The...
- Publication number 20120039564
- Publication date Feb 16, 2012
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method for Forming the Same
- Publication number 20110195569
- Publication date Aug 11, 2011
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect of Semiconductor Device
- Publication number 20100230824
- Publication date Sep 16, 2010
- Jongmyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20100227473
- Publication date Sep 9, 2010
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Gilheyun Choi

Person

Patents Grantslast 30 patents

Wafer carrier having cavity

Methods for fabricating semiconductor devices having through electr...

Semiconductor devices including through-silicon via

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices including stress relief structures

Semiconductor devices and methods of fabricating the same

Semiconductor devices having conductive via structures and methods...

Semiconductor devices including through silicon via electrodes and...

Microelectronic devices having conductive through via electrodes in...

Semiconductor devices including a non-planar conductive pattern, an...

Semiconductor devices and methods of fabricating the same

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices having through electrodes

Semiconductor devices having through electrodes and methods of fabr...

Semiconductor chips and methods of forming the same

Semiconductor devices including protected barrier layers

Semiconductor devices having through electrodes and methods of fabr...

Metal interconnect of semiconductor device

Methods of forming metal patterns in openings in semiconductor devices

Methods of forming metal patterns in openings in semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

APPARATUS AND METHODS FOR TREATING SUBSTRATES

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Methods for Fabricating Semiconductor Devices Having Through Electr...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Wafer Carrier Having Cavity

SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...

Semiconductor Devices Having Through Electrodes and Methods of Fabr...

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIA STRUCTURES AND METHODS...

Semiconductor Devices Having Through-Vias and Methods for Fabricati...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES

Semiconductor Devices Including Protected Barrier Layers

SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF FABR...

MICROELECTRONIC DEVICES INCLUDING THROUGH SILICON VIA STRUCTURES HA...

SEMICONDUCTOR DEVICES INCLUDING STRESS RELIEF STRUCTURES

MICROELECTRONIC DEVICES HAVING CONDUCTIVE THROUGH VIA ELECTRODES IN...

Methods of Forming Metal Patterns in Openings in Semiconductor Devices

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

Photoelectric Integrated Circuit Devices And Methods Of Forming The...

Semiconductor Device and Method for Forming the Same

Metal Interconnect of Semiconductor Device

Methods of Forming Metal Patterns in Openings in Semiconductor Devices