Gilles Delarozee

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Muenchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package having a cooling surface and method of m...
- Patent number 10,727,151
- Issue date Jul 28, 2020
- Infineon Technologies AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with leadframe
- Patent number 10,319,671
- Issue date Jun 11, 2019
- Infineon Technologies AG
- Dirk Ahlers
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Transistor package with terminals coupled via chip carrier
- Patent number 9,978,672
- Issue date May 22, 2018
- Infineon Technologies AG
- Dirk Ahlers
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module including semiconductor chips coupled to exter...
- Patent number 8,120,161
- Issue date Feb 21, 2012
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Chip Package Having a Cooling Surface and Method of M...
- Publication number 20180342438
- Publication date Nov 29, 2018
- INFINEON TECHNOLOGIES AG
- Liu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Leadframe
- Publication number 20180342447
- Publication date Nov 29, 2018
- INFINEON TECHNOLOGIES AG
- Dirk Ahlers
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor Module
- Publication number 20080251859
- Publication date Oct 16, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS