Gin-Nan Yeh

Follow

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of attaching a heat sink to an IC package
- Patent number 6,918,178
- Issue date Jul 19, 2005
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of attaching a heat sink to an IC package
- Publication number 20030106212
- Publication date Jun 12, 2003
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS