Giorgio Viero

Person

Stezzano, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Handling and positioning of metallic plated balls for socket applic...
- Patent number 7,524,698
- Issue date Apr 28, 2009
- International Business Machines Corporation
- Giorgio Viero
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial via structure for optimizing signal transmission in multipl...
- Patent number 7,360,308
- Issue date Apr 22, 2008
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of stacked vias in multiple layer electrode device carriers
- Patent number 7,319,197
- Issue date Jan 15, 2008
- International Business Machines Corporation
- Stefano Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial via structure for optimizing signal transmission in multipl...
- Patent number 7,091,424
- Issue date Aug 15, 2006
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES
- Publication number 20070230150
- Publication date Oct 4, 2007
- International Business Machines Corporation
- Michele Castriotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COAXIAL VIA STRUCTURE FOR OPTIMIZING SIGNAL TRANSMISSION IN MULTIPL...
- Publication number 20060288574
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING AND POSITIONING OF METALLIC PLATED BALLS FOR SOCKET APPLIC...
- Publication number 20060255461
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Giorgio Viero
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES
- Publication number 20060196917
- Publication date Sep 7, 2006
- International Business Machines Corporation
- Giorgio Viero
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED PLATING PROCESS FOR MULTILAYER PRINTED CIRCUIT BOARDS HAV...
- Publication number 20060008970
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Stefano Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of stacked vias in multiple layer electronic device carriers
- Publication number 20050156319
- Publication date Jul 21, 2005
- Stefano Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED CONDUCTIVE LID MOUNTING FOR INTEGRATED CIRCUIT CHIP CARRIERS
- Publication number 20040150097
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coaxial via structure for optimizing signal transmission in multipl...
- Publication number 20040069529
- Publication date Apr 15, 2004
- International Business Machines Corporation
- Stefano S. Oggioni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Giorgio Viero

Person

Patents Grantslast 30 patents

Handling and positioning of metallic plated balls for socket applic...

Coaxial via structure for optimizing signal transmission in multipl...

Structure of stacked vias in multiple layer electrode device carriers

Coaxial via structure for optimizing signal transmission in multipl...

Patents Applicationslast 30 patents

POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES

COAXIAL VIA STRUCTURE FOR OPTIMIZING SIGNAL TRANSMISSION IN MULTIPL...

HANDLING AND POSITIONING OF METALLIC PLATED BALLS FOR SOCKET APPLIC...

METALLIC PLATING FOR SOCKET APPLICATION IN BALL GRID ARRAY PACKAGES

OPTIMIZED PLATING PROCESS FOR MULTILAYER PRINTED CIRCUIT BOARDS HAV...

Structure of stacked vias in multiple layer electronic device carriers

OPTIMIZED CONDUCTIVE LID MOUNTING FOR INTEGRATED CIRCUIT CHIP CARRIERS

Coaxial via structure for optimizing signal transmission in multipl...