Girard Sidone

Person

Bordentown, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preforms and solder alloy assembly methods
- Patent number 9,801,285
- Issue date Oct 24, 2017
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
- Publication number 20240198460
- Publication date Jun 20, 2024
- Alpha Assembly Solutions Inc.
- Ranjit PANDHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20240021565
- Publication date Jan 18, 2024
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
- Publication number 20230146579
- Publication date May 11, 2023
- Alpha Assembly Solutions Inc.
- Ranjit PANDHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preforms and Solder Alloy Assembly Methods
- Publication number 20180020554
- Publication date Jan 18, 2018
- Alpha Assembly Solutions Inc.
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS
- Publication number 20150078810
- Publication date Mar 19, 2015
- ALPHA METALS, INC.
- Paul Joseph Koep
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Girard Sidone

Person

Patents Grantslast 30 patents

Solder material and method for die attachment

Solder preforms and solder alloy assembly methods

Patents Applicationslast 30 patents

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

Solder Preforms and Solder Alloy Assembly Methods

SOLDER PREFORMS AND SOLDER ALLOY ASSEMBLY METHODS