Giridhar Nallapati

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitors in an inter-layer medium on an interconnect...
- Patent number 11,973,019
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor with top contact
- Patent number 11,973,020
- Issue date Apr 30, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits (ICs) employing directly coupled metal lines be...
- Patent number 11,942,414
- Issue date Mar 26, 2024
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors (FET) circuits employing topside and backs...
- Patent number 11,437,379
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid low resistance metal lines
- Patent number 11,404,373
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact liner to enable different CPP devices
- Patent number 10,847,507
- Issue date Nov 24, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finger metal-oxide-metal (FMOM) capacitor
- Patent number 10,686,031
- Issue date Jun 16, 2020
- QUALCOMM Incorporated
- Peijie Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) interconnect structure having a metal layer...
- Patent number 10,651,122
- Issue date May 12, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of metal wraparound for low via resistance
- Patent number 10,636,737
- Issue date Apr 28, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified self-aligned quadruple patterning (SAQP) processes using c...
- Patent number 10,418,244
- Issue date Sep 17, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High density and reliable vertical natural capacitors
- Patent number 10,325,979
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive pulse generation circuits for clocking pulse latches with...
- Patent number 10,291,211
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Middle-of-line (MOL) metal resistor temperature sensors for localiz...
- Patent number 10,247,617
- Issue date Apr 2, 2019
- QUALCOMM Incorporated
- Lixin Ge
- G01 - MEASURING TESTING
Information Patent Grant
Metal-insulator-metal capacitor over conductive layer
- Patent number 9,818,817
- Issue date Nov 14, 2017
- QUALCOMM Incorporated
- John J. Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor under redistribution layer
- Patent number 9,287,347
- Issue date Mar 15, 2016
- QUALCOMM Incorporated
- John J. Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having high mobility channel
- Patent number 9,245,971
- Issue date Jan 26, 2016
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a diffusion bridged cell library
- Patent number 9,070,551
- Issue date Jun 30, 2015
- QUALCOMM Incorporated
- Benjamin John Bowers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Local interconnect structures for high density
- Patent number 9,024,418
- Issue date May 5, 2015
- QUALCOMM Incorporated
- John Jianhong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared-diffusion standard cell architecture
- Patent number 8,836,040
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a diffusion bridged cell library
- Patent number 8,782,576
- Issue date Jul 15, 2014
- QUALCOMM Incorporated
- Benjamin John Bowers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS
- Publication number 20250015047
- Publication date Jan 9, 2025
- QUALCOMM Incorporated
- Mustafa BADAROGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BE...
- Publication number 20240203866
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) WITH BALANCED N AND P...
- Publication number 20240204109
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL
- Publication number 20240105728
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL CHANNEL FIELD EFFECT TRANSISTOR (VCFET) WITH REDUCED CONTA...
- Publication number 20240096964
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VIA RESISTANCE INTERCONNECT STRUCTURE
- Publication number 20230223341
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BE...
- Publication number 20230108523
- Publication date Apr 6, 2023
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH TOP CONTACT
- Publication number 20230072667
- Publication date Mar 9, 2023
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...
- Publication number 20220375851
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20220344250
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE FUNCTION BLOCKS ON A SYSTEM ON A CHIP (SOC)
- Publication number 20220336351
- Publication date Oct 20, 2022
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CELL WITH SELF-ALIGNED GATE CONTACT
- Publication number 20220336607
- Publication date Oct 20, 2022
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...
- Publication number 20220093594
- Publication date Mar 24, 2022
- QUALCOMM Incorporated
- Stanley Seungchul SONG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
VIA ZERO INTERCONNECT LAYER METAL RESISTOR INTEGRATION
- Publication number 20210305155
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW RESISTANCE METAL LINES
- Publication number 20210167006
- Publication date Jun 3, 2021
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER-BASED CONDUCTOR CUT
- Publication number 20210143056
- Publication date May 13, 2021
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA INTEGRATION IN INTEGRATED CIRCUITS
- Publication number 20210125862
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- John Jianhong ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF METAL WRAPAROUND FOR LOW VIA RESISTANCE
- Publication number 20200066630
- Publication date Feb 27, 2020
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED METAL-OXIDE-SEMICONDUCTOR, METAL-OXIDE-METAL, AND METAL-INS...
- Publication number 20200020686
- Publication date Jan 16, 2020
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT LINER TO ENABLE DIFFERENT CPP DEVICES
- Publication number 20190378830
- Publication date Dec 12, 2019
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGER METAL-OXIDE-METAL (FMOM) CAPACITOR
- Publication number 20190305077
- Publication date Oct 3, 2019
- QUALCOMM Incorporated
- Peijie FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY AND RELIABLE VERTICAL NATURAL CAPACITORS
- Publication number 20190206984
- Publication date Jul 4, 2019
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE (MOL) METAL RESISTOR TEMPERATURE SENSORS FOR LOCALI...
- Publication number 20190195700
- Publication date Jun 27, 2019
- QUALCOMM Incorporated
- Lixin Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) PROCESSES USING C...
- Publication number 20180204765
- Publication date Jul 19, 2018
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE PULSE GENERATION CIRCUITS FOR CLOCKING PULSE LATCHES WITH...
- Publication number 20180069535
- Publication date Mar 8, 2018
- QUALCOMM TECHNOLOGIES, INC.
- Stanley Seungchul Song
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MIDDLE-OF-LINE (MOL) METAL RESISTOR TEMPERATURE SENSORS FOR LOCALI...
- Publication number 20180058943
- Publication date Mar 1, 2018
- QUALCOMM Incorporated
- Lixin Ge
- G01 - MEASURING TESTING
Information Patent Application
HETEROGENEOUS CELL ARRAY
- Publication number 20170338215
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Stanley Seungchul Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE (BEOL) LOCAL OPTIMIZATION TO IMPROVE PRODUCT PERFO...
- Publication number 20150303145
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- John Jianhong ZHU
- G06 - COMPUTING CALCULATING COUNTING

Giridhar Nallapati

Person

Patents Grantslast 30 patents

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Deep trench capacitors in an inter-layer medium on an interconnect...

Metal-insulator-metal capacitor with top contact

Integrated circuits (ICs) employing directly coupled metal lines be...

Field-effect transistors (FET) circuits employing topside and backs...

Hybrid low resistance metal lines

Contact liner to enable different CPP devices

Finger metal-oxide-metal (FMOM) capacitor

Integrated circuit (IC) interconnect structure having a metal layer...

Structure and method of metal wraparound for low via resistance

Modified self-aligned quadruple patterning (SAQP) processes using c...

High density and reliable vertical natural capacitors

Adaptive pulse generation circuits for clocking pulse latches with...

Middle-of-line (MOL) metal resistor temperature sensors for localiz...

Metal-insulator-metal capacitor over conductive layer

Metal-insulator-metal capacitor under redistribution layer

Semiconductor device having high mobility channel

Method and apparatus for a diffusion bridged cell library

Local interconnect structures for high density

Shared-diffusion standard cell architecture

Method and apparatus for a diffusion bridged cell library

Patents Applicationslast 30 patents

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS

INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BE...

COMPLEMENTARY FIELD EFFECT TRANSISTOR (CFET) WITH BALANCED N AND P...

TRANSISTOR DEVICES WITH DOUBLE-SIDE CONTACTS AND STANDARD CELL

VERTICAL CHANNEL FIELD EFFECT TRANSISTOR (VCFET) WITH REDUCED CONTA...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

LOW VIA RESISTANCE INTERCONNECT STRUCTURE

INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BE...

METAL-INSULATOR-METAL CAPACITOR WITH TOP CONTACT

DEEP TRENCH CAPACITORS IN AN INTER-LAYER MEDIUM ON AN INTERCONNECT...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

MULTIPLE FUNCTION BLOCKS ON A SYSTEM ON A CHIP (SOC)

TRANSISTOR CELL WITH SELF-ALIGNED GATE CONTACT

FIELD-EFFECT TRANSISTORS (FET) CIRCUITS EMPLOYING TOPSIDE AND BACKS...

VIA ZERO INTERCONNECT LAYER METAL RESISTOR INTEGRATION

HYBRID LOW RESISTANCE METAL LINES

SPACER-BASED CONDUCTOR CUT

SUPER VIA INTEGRATION IN INTEGRATED CIRCUITS

STRUCTURE AND METHOD OF METAL WRAPAROUND FOR LOW VIA RESISTANCE

STACKED METAL-OXIDE-SEMICONDUCTOR, METAL-OXIDE-METAL, AND METAL-INS...

CONTACT LINER TO ENABLE DIFFERENT CPP DEVICES

FINGER METAL-OXIDE-METAL (FMOM) CAPACITOR

HIGH DENSITY AND RELIABLE VERTICAL NATURAL CAPACITORS

MIDDLE-OF-LINE (MOL) METAL RESISTOR TEMPERATURE SENSORS FOR LOCALI...

MODIFIED SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) PROCESSES USING C...

ADAPTIVE PULSE GENERATION CIRCUITS FOR CLOCKING PULSE LATCHES WITH...

MIDDLE-OF-LINE (MOL) METAL RESISTOR TEMPERATURE SENSORS FOR LOCALI...

HETEROGENEOUS CELL ARRAY

BACK END OF LINE (BEOL) LOCAL OPTIMIZATION TO IMPROVE PRODUCT PERFO...