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Gisela Schammler
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Dresden, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Reducing contamination in a process flow of forming a channel semic...
Patent number
8,513,080
Issue date
Aug 20, 2013
GLOBALFOUNDRIES Inc.
Stephan Kronholz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing contamination in a process flow of forming a channel semic...
Patent number
8,048,748
Issue date
Nov 1, 2011
GLOBALFOUNDRIES Inc.
Stephan Kronholz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soft error resistant semiconductor device
Patent number
6,894,390
Issue date
May 17, 2005
Advanced Micro Devices, Inc.
Gisela Schammler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump structure and a method of forming the same
Patent number
6,639,314
Issue date
Oct 28, 2003
Advanced Micro Devices, Inc.
Mathias Boettcher
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
REDUCING CONTAMINATION IN A PROCESS FLOW OF FORMING A CHANNEL SEMIC...
Publication number
20120009751
Publication date
Jan 12, 2012
GLOBALFOUNDRIES INC.
Stephan Kronholz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCING CONTAMINATION IN A PROCESS FLOW OF FORMING A CHANNEL SEMIC...
Publication number
20110189831
Publication date
Aug 4, 2011
Stephan Kronholz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Soft error resistant semiconductor device
Publication number
20040164409
Publication date
Aug 26, 2004
Gisela Schammler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder bump structure and a method of forming the same
Publication number
20030052415
Publication date
Mar 20, 2003
Mathias Boettcher
H01 - BASIC ELECTRIC ELEMENTS