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Giuseppe Miccoli

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  • Munich, DE
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHODS AND STRUCTURES FOR DICING INTEGRATED CIRCUITS FROM A WAFER
    • Publication number 20180096952
    • Publication date Apr 5, 2018
    • Intel IP Corporation
    • GIUSEPPE MICCOLI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Dicing a Wafer
    • Publication number 20140329373
    • Publication date Nov 6, 2014
    • Giuseppe Miccoli
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer and a Method of Dicing a Wafer
    • Publication number 20140167226
    • Publication date Jun 19, 2014
    • INFINEON TECHNOLOGIES AG
    • Giuseppe Miccoli
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of Dicing a Wafer
    • Publication number 20120211748
    • Publication date Aug 23, 2012
    • INFINEON TECHNOLOGIES AG
    • Giuseppe Miccoli
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer and a Method of Dicing a Wafer
    • Publication number 20090121321
    • Publication date May 14, 2009
    • Giuseppe Miccoli
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY