Glen E. Richard

Person

Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Separation of integrated circuit structure from adjacent chip
- Patent number 10,256,204
- Issue date Apr 9, 2019
- GLOBALFOUNDRIES Inc.
- Glen E Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip joining by induction heating
- Patent number 10,245,667
- Issue date Apr 2, 2019
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for semiconductor die removal rework
- Patent number 10,050,012
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip joining by induction heating
- Patent number 9,776,270
- Issue date Oct 3, 2017
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Visually detecting electrostatic discharge events
- Patent number 9,711,422
- Issue date Jul 18, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of making
- Patent number 9,704,830
- Issue date Jul 11, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability monitor test strategy definition
- Patent number 9,645,573
- Issue date May 9, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- G05 - CONTROLLING REGULATING
Information Patent Grant
Induction heating for underfill removal and chip rework
- Patent number 9,508,680
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure with recessed solder bump area and methods of forming...
- Patent number 9,472,490
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Timothy M. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump reflow by induction heating
- Patent number 9,190,375
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES, INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing thermal energy transfer during chip-join processing
- Patent number 9,177,931
- Issue date Nov 3, 2015
- GlobalFoundries U.S. 2 LLC
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visually detecting electrostatic discharge events
- Patent number 9,105,573
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Inhibiting propagation of imperfections in semiconductor devices
- Patent number 9,059,097
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled collapse chip connection (C4) structure and methods of f...
- Patent number 8,765,593
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal cache for on chip test data storage
- Patent number 6,901,542
- Issue date May 31, 2005
- International Business Machines Corporation
- Thomas W. Bartenstein
- G11 - INFORMATION STORAGE
Information Patent Grant
Incremental fault dictionary
- Patent number 6,675,323
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Thomas W. Bartenstein
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP
- Publication number 20180130733
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Glen E. Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20170312841
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20170200699
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DIE REMOVAL REWORK
- Publication number 20170148762
- Publication date May 25, 2017
- International Business Machine Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTION HEATING FOR UNDERFILL REMOVAL AND CHIP REWORK
- Publication number 20160372444
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RELIABILITY MONITOR TEST STRATEGY DEFINITION
- Publication number 20160147220
- Publication date May 26, 2016
- International Business Machines Corporation
- Stephen P. Ayotte
- G05 - CONTROLLING REGULATING
Information Patent Application
VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS
- Publication number 20150355253
- Publication date Dec 10, 2015
- GLOBALFOUNDRIES Inc.
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING THERMAL ENERGY TRANSFER DURING CHIP-JOIN PROCESSING
- Publication number 20150243618
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP JOINING BY INDUCTION HEATING
- Publication number 20150089805
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...
- Publication number 20140042630
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITING PROPAGATION OF IMPERFECTIONS IN SEMICONDUCTOR DEVICES
- Publication number 20140042594
- Publication date Feb 13, 2014
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS
- Publication number 20130257624
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Stephen P. AYOTTE
- G01 - MEASURING TESTING
Information Patent Application
Incremental fault dictionary
- Publication number 20030046608
- Publication date Mar 6, 2003
- Thomas W. Bartenstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Internal cache for on chip test data storage
- Publication number 20030033566
- Publication date Feb 13, 2003
- International Business Machines Corporation
- Thomas W. Bartenstein
- G11 - INFORMATION STORAGE

Glen E. Richard

Person

Patents Grantslast 30 patents

Separation of integrated circuit structure from adjacent chip

Chip joining by induction heating

Method for semiconductor die removal rework

Chip joining by induction heating

Visually detecting electrostatic discharge events

Semiconductor structure and method of making

Reliability monitor test strategy definition

Induction heating for underfill removal and chip rework

IC structure with recessed solder bump area and methods of forming...

Solder bump reflow by induction heating

Reducing thermal energy transfer during chip-join processing

Visually detecting electrostatic discharge events

Inhibiting propagation of imperfections in semiconductor devices

Controlled collapse chip connection (C4) structure and methods of f...

Internal cache for on chip test data storage

Incremental fault dictionary

Patents Applicationslast 30 patents

SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP

CHIP JOINING BY INDUCTION HEATING

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

METHOD AND STRUCTURE FOR SEMICONDUCTOR DIE REMOVAL REWORK

INDUCTION HEATING FOR UNDERFILL REMOVAL AND CHIP REWORK

RELIABILITY MONITOR TEST STRATEGY DEFINITION

VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS

SOLDER BUMP REFLOW BY INDUCTION HEATING

REDUCING THERMAL ENERGY TRANSFER DURING CHIP-JOIN PROCESSING

CHIP JOINING BY INDUCTION HEATING

CONTROLLED COLLAPSE CHIP CONNECTION (C4) STRUCTURE AND METHODS OF F...

INHIBITING PROPAGATION OF IMPERFECTIONS IN SEMICONDUCTOR DEVICES

VISUALLY DETECTING ELECTROSTATIC DISCHARGE EVENTS

Incremental fault dictionary

Internal cache for on chip test data storage