Glen T. Kim

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Daisy chain connection for testing continuity in a semiconductor die
- Patent number 9,024,315
- Issue date May 5, 2015
- Qualcomm, Incorporated
- Hongjun Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAISY CHAIN CONNECTION FOR TESTING CONTINUITY IN A SEMICONDUCTOR DIE
- Publication number 20140264331
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Hongjun Yao
- G01 - MEASURING TESTING
Information Patent Application
LOW COST HIGH THROUGHPUT TSV/MICROBUMP PROBE
- Publication number 20130297981
- Publication date Nov 7, 2013
- QUALCOMM Incorporated
- Shiqun Gu
- G01 - MEASURING TESTING