Glen W Devos

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Fort Wayne, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating assembly for removing heat from a flip chip semico...
- Patent number 6,365,964
- Issue date Apr 2, 2002
- Delphi Technologies, Inc.
- Mark Anthony Koors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing heat from a flip chip semiconductor device
- Patent number 6,180,436
- Issue date Jan 30, 2001
- Delco Electronics Corporation
- Mark Anthony Koors
- H01 - BASIC ELECTRIC ELEMENTS