Glenn C. Narvaez

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Redwood City, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale and land grid array semiconductor packages
- Patent number 6,551,859
- Issue date Apr 22, 2003
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for use in semiconductor packaging
- Patent number 6,396,135
- Issue date May 28, 2002
- National Semiconductor Corporation
- Glenn C. Narvaez
- H01 - BASIC ELECTRIC ELEMENTS