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Glenn E. Gold
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Coconut Creek, FL, US
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last 30 patents
Information
Patent Grant
Moisture enhanced ball grid array package
Patent number
6,242,802
Issue date
Jun 5, 2001
Motorola, Inc.
Barry M. Miles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile exposed die chip carrier package
Patent number
5,696,666
Issue date
Dec 9, 1997
Motorola, Inc.
Barry M. Miles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated electronic component having a heat diffusing layer
Patent number
5,379,186
Issue date
Jan 3, 1995
Motorola, Inc.
Glenn E. Gold
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated electronic package
Patent number
5,313,365
Issue date
May 17, 1994
Motorola, Inc.
Robert W. Pennisi
H01 - BASIC ELECTRIC ELEMENTS