Glenn G. Daves

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multicore processor and method of use that adapts core functions ba...
- Patent number 8,645,673
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Robert H. Bell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multicore processor and method of use that adapts core functions ba...
- Patent number 8,327,126
- Issue date Dec 4, 2012
- International Business Machines Corporation
- Robert H. Bell, Jr.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,900,809
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power grid structure to optimize performance of a multiple core pro...
- Patent number 7,667,470
- Issue date Feb 23, 2010
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,445,141
- Issue date Nov 4, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power grid structure to optimize performance of a multiple core pro...
- Patent number 7,420,378
- Issue date Sep 2, 2008
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive adhesive composition
- Patent number 7,405,247
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive adhesive rework method
- Patent number 7,393,419
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal interface adhesive and rework
- Patent number 7,312,261
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Apparatus and method for customized burn-in of cores on a multicore...
- Patent number 7,268,570
- Issue date Sep 11, 2007
- International Business Machines Corporation
- Jean Audet
- G01 - MEASURING TESTING
Information Patent Grant
Flexure plate for maintaining contact between a cooling plate/heat...
- Patent number 7,239,516
- Issue date Jul 3, 2007
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic cooling systems and methods for electronic components
- Patent number 7,079,393
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,974,722
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture of silicon based package
- Patent number 6,878,608
- Issue date Apr 12, 2005
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jogging structure for wiring translation between grids with non-int...
- Patent number 6,762,489
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating interposer between two electronic components and process...
- Patent number 6,541,365
- Issue date Apr 1, 2003
- David L. Edwards
- G01 - MEASURING TESTING
Information Patent Grant
Thermal paste preforms as a heat transfer media between a chip and...
- Patent number 6,444,496
- Issue date Sep 3, 2002
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating interposer between two electronic components and process...
- Patent number 6,365,977
- Issue date Apr 2, 2002
- International Business Machines Corporation
- David L. Edwards
- G01 - MEASURING TESTING
Information Patent Grant
Methods for customizing lid for improved thermal performance of mod...
- Patent number 6,292,369
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Glenn G. Daves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paste preforms as a heat transfer media between a chip and...
- Patent number 6,275,381
- Issue date Aug 14, 2001
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customizable lid for improved thermal performance of modules using...
- Patent number 6,091,603
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Glenn G. Daves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance, low cost multi-chip modle package
- Patent number 5,838,545
- Issue date Nov 17, 1998
- International Business Machines Corporation
- Dennis F. Clocher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multicore Processor and Method of Use That Adapts Core Functions Ba...
- Publication number 20130013903
- Publication date Jan 10, 2013
- International Business Machines Corporation
- Robert H. Bell, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multicore Processor and Method of Use That Adapts Core Functions Ba...
- Publication number 20100049963
- Publication date Feb 25, 2010
- Robert H. Bell, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY
- Publication number 20080261350
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Grid Structure to Optimize Performance of a Multiple Core Pro...
- Publication number 20080252308
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE ADHESIVE REWORK METHOD
- Publication number 20080017223
- Publication date Jan 24, 2008
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POWER GRID STRUCTURE TO OPTIMIZE PERFORMANCE OF A MULTIPLE CORE PRO...
- Publication number 20080012583
- Publication date Jan 17, 2008
- JEAN AUDET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20070270536
- Publication date Nov 22, 2007
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS
- Publication number 20060104031
- Publication date May 18, 2006
- International Business Machines Corporation
- Evan George Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY
- Publication number 20060060636
- Publication date Mar 23, 2006
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexure plate for maintaining contact between a cooling plate/heat...
- Publication number 20060056156
- Publication date Mar 16, 2006
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE ADHESIVE AND REWORK
- Publication number 20050256241
- Publication date Nov 17, 2005
- International Business Machines Corporation
- Krishna G. Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...
- Publication number 20040188823
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method for wiring translation between grids with non-...
- Publication number 20030094687
- Publication date May 22, 2003
- Glenn G. Daves
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacture of silicon based package and device manufactu...
- Publication number 20020180013
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating interposer between two electronic components and process...
- Publication number 20020034888
- Publication date Mar 21, 2002
- International Business Machines Corpration
- David L. Edwards
- G01 - MEASURING TESTING

Glenn G. Daves

Person

Patents Grantslast 30 patents

Multicore processor and method of use that adapts core functions ba...

Multicore processor and method of use that adapts core functions ba...

Solder interconnection array with optimal mechanical integrity

Power grid structure to optimize performance of a multiple core pro...

Solder interconnection array with optimal mechanical integrity

Power grid structure to optimize performance of a multiple core pro...

Conductive adhesive composition

Conductive adhesive rework method

Thermal interface adhesive and rework

Apparatus and method for customized burn-in of cores on a multicore...

Flexure plate for maintaining contact between a cooling plate/heat...

Fluidic cooling systems and methods for electronic components

Jogging structure for wiring translation between grids with non-int...

Method of manufacture of silicon based package

Jogging structure for wiring translation between grids with non-int...

Insulating interposer between two electronic components and process...

Thermal paste preforms as a heat transfer media between a chip and...

Insulating interposer between two electronic components and process...

Methods for customizing lid for improved thermal performance of mod...

Thermal paste preforms as a heat transfer media between a chip and...

Customizable lid for improved thermal performance of modules using...

High performance, low cost multi-chip modle package

Patents Applicationslast 30 patents

Multicore Processor and Method of Use That Adapts Core Functions Ba...

Multicore Processor and Method of Use That Adapts Core Functions Ba...

SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY

Power Grid Structure to Optimize Performance of a Multiple Core Pro...

CONDUCTIVE ADHESIVE REWORK METHOD

POWER GRID STRUCTURE TO OPTIMIZE PERFORMANCE OF A MULTIPLE CORE PRO...

CONDUCTIVE ADHESIVE COMPOSITION

FLUIDIC COOLING SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS

SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY

Flexure plate for maintaining contact between a cooling plate/heat...

THERMAL INTERFACE ADHESIVE AND REWORK

JOGGING STRUCTURE FOR WIRING TRANSLATION BETWEEN GRIDS WITH NON-INT...

Structure and method for wiring translation between grids with non-...

Method of manufacture of silicon based package and device manufactu...

Insulating interposer between two electronic components and process...