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Glenn J. Tessmer
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Richardson, TX, US
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Patents Grants
last 30 patents
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Patent Grant
Nickel silicide—silicon nitride adhesion through surface pa...
Patent number
6,831,008
Issue date
Dec 14, 2004
Texas Instruments Incorporated
Jiong-Ping Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing contamination, copper reduction, and depositing...
Patent number
6,790,777
Issue date
Sep 14, 2004
Texas Instruments Incorporated
Glenn J. Tessmer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTEC...
Publication number
20080111244
Publication date
May 15, 2008
TEXAS INSTRUMENTS INCORPORATED
Glenn J. Tessmer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Nickel silicide - silicon nitride adhesion through surface passivation
Publication number
20050090087
Publication date
Apr 28, 2005
Jiong-Ping Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for reducing contamination, copper reduction, and depositing...
Publication number
20040087149
Publication date
May 6, 2004
Glenn J. Tessmer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Nickel silicide - silicon nitride adhesion through surface passivation
Publication number
20040061184
Publication date
Apr 1, 2004
Jiong-Ping Lu
H01 - BASIC ELECTRIC ELEMENTS