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Glenn O. Dearing
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Endicott, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Method of packaging a high performance chip
Patent number
6,655,020
Issue date
Dec 2, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High performance chip packaging and method
Patent number
6,552,264
Issue date
Apr 22, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High performance chip packaging and method
Patent number
6,552,266
Issue date
Apr 22, 2003
International Business Machines Corporation
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
HIGH PERFORMANCE CHIP PACKAGING AND METHOD
Publication number
20020053449
Publication date
May 9, 2002
TIMOTHY F. CARDEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
High performance chip packaging and method
Publication number
20010009196
Publication date
Jul 26, 2001
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High performance chip packaging and method
Publication number
20010009197
Publication date
Jul 26, 2001
Timothy F. Carden
H01 - BASIC ELECTRIC ELEMENTS