Glenn Omandam

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming thick encapsulant for st...
- Patent number 9,281,259
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making TSV interconnect structur...
- Patent number 9,054,083
- Issue date Jun 9, 2015
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of laser-marking laminate layer for...
- Patent number 8,916,416
- Issue date Dec 23, 2014
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an interconnect structure with TSV usin...
- Patent number 8,659,162
- Issue date Feb 25, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming thick encapsulant for st...
- Patent number 8,610,286
- Issue date Dec 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 8,067,308
- Issue date Nov 29, 2011
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of laser-marking wafers with tape a...
- Patent number 7,829,384
- Issue date Nov 9, 2010
- STATS ChipPAC, Ltd.
- Glenn Omandam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20140110861
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thick Encapsulant for St...
- Publication number 20140061944
- Publication date Mar 6, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thick Encapsulant for St...
- Publication number 20130147054
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Laser-Marking Laminate Layer For...
- Publication number 20130127039
- Publication date May 23, 2013
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20120013004
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Laser-Marking Laminate Layer For...
- Publication number 20110012258
- Publication date Jan 20, 2011
- STATS ChipPAC, Ltd.
- Glenn Omandam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100308443
- Publication date Dec 9, 2010
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Laser-Marking Wafers with Tape A...
- Publication number 20090081830
- Publication date Mar 26, 2009
- STATS ChipPAC, Ltd.
- Glenn Omandam
- H01 - BASIC ELECTRIC ELEMENTS

Glenn Omandam

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming thick encapsulant for st...

Semiconductor device and method of making TSV interconnect structur...

Semiconductor device and method of laser-marking laminate layer for...

Semiconductor device having an interconnect structure with TSV usin...

Semiconductor device and method of forming thick encapsulant for st...

Semiconductor device and method of forming an interconnect structur...

Semiconductor device and method of laser-marking wafers with tape a...

Patents Applicationslast 30 patents

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Semiconductor Device and Method of Forming Thick Encapsulant for St...

Semiconductor Device and Method of Forming Thick Encapsulant for St...

Semiconductor Device and Method of Laser-Marking Laminate Layer For...

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Semiconductor Device and Method of Laser-Marking Laminate Layer For...

Semiconductor Device and Method of Forming an Interconnect Structur...

Semiconductor Device and Method of Laser-Marking Wafers with Tape A...