Glenn Rinne

Person

Apex, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 11,183,493
- Issue date Nov 23, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,031,370
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,832,921
- Issue date Nov 10, 2020
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 10,410,993
- Issue date Sep 10, 2019
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 10,388,643
- Issue date Aug 20, 2019
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 10,304,697
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,157,872
- Issue date Dec 18, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,115,705
- Issue date Oct 30, 2018
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 10,056,349
- Issue date Aug 21, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,037,957
- Issue date Jul 31, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 9,978,644
- Issue date May 22, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 9,837,376
- Issue date Dec 5, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 9,627,368
- Issue date Apr 18, 2017
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 9,490,231
- Issue date Nov 8, 2016
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 9,412,729
- Issue date Aug 9, 2016
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,406,639
- Issue date Aug 2, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafers including patterned back side layers thereon
- Patent number 8,643,177
- Issue date Feb 4, 2014
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structures including barrier layers and/or oxidation bar...
- Patent number 8,487,432
- Issue date Jul 16, 2013
- Amkor Technology, Inc.
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic structures including conductive layers comprising copper...
- Patent number 8,294,269
- Issue date Oct 23, 2012
- Unitive International
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free alloy bump structure and fabrication method
- Patent number 7,994,043
- Issue date Aug 9, 2011
- Amkor Technology, Inc.
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including solder bumps on compliant dielectric l...
- Patent number 7,932,615
- Issue date Apr 26, 2011
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic structures including conductive shunt...
- Patent number 7,879,715
- Issue date Feb 1, 2011
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming back side layers for thinned wafers
- Patent number 7,871,899
- Issue date Jan 18, 2011
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...
- Publication number 20220181314
- Publication date Jun 9, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210366871
- Publication date Nov 25, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20210043465
- Publication date Feb 11, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...
- Publication number 20200203331
- Publication date Jun 25, 2020
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200194402
- Publication date Jun 18, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190279882
- Publication date Sep 12, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20190109018
- Publication date Apr 11, 2019
- Amkor Technology, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20180374820
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180323161
- Publication date Nov 8, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20180247909
- Publication date Aug 30, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180138138
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Greg Hames
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20180102342
- Publication date Apr 12, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20180047692
- Publication date Feb 15, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...
- Publication number 20170271315
- Publication date Sep 21, 2017
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSIENT INTERFACE GRADIENT BONDING FOR METAL BONDS
- Publication number 20170162535
- Publication date Jun 8, 2017
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20170117249
- Publication date Apr 27, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20160322334
- Publication date Nov 3, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20160056055
- Publication date Feb 25, 2016
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR SIDEWALL PROTECTION
- Publication number 20150340332
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20150041975
- Publication date Feb 12, 2015
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...
- Publication number 20140147970
- Publication date May 29, 2014
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20140042600
- Publication date Feb 13, 2014
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Structures Including Conductive Layers Comprising Copper...
- Publication number 20110084392
- Publication date Apr 14, 2011
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Back Side Layers For Thinned Wafers and Related...
- Publication number 20110079901
- Publication date Apr 7, 2011
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Structures Including Barrier Layers and/or Oxidation Bar...
- Publication number 20110037171
- Publication date Feb 17, 2011
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Structures Including Barrier Layers with Nickel and/or Copper
- Publication number 20090212427
- Publication date Aug 27, 2009
- UNITIVE INTERNATIONAL LIMITED
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Structures Including Barrier Layers Defining Lips
- Publication number 20080308931
- Publication date Dec 18, 2008
- UNITIVE INTERNATIONAL LIMITED
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Glenn Rinne

Person

Patents Grantslast 30 patents

Electronic device with top side pin array and manufacturing method...

Method and system for packing optimization of semiconductor devices

Semiconductor device and manufacturing method thereof

Method and system for packing optimization of semiconductor devices

Semiconductor device using EMC wafer support system and fabricating...

Semiconductor device and manufacturing method thereof

Electronic device with top side pin array and manufacturing method...

Method and system for packing optimization of semiconductor devices

Manufacturing method of semiconductor device and semiconductor devi...

Semiconductor device using EMC wafer support system and fabricating...

Electronic device with top side pin array and manufacturing method...

Semiconductor device and method of manufacturing thereof

Semiconductor package and manufacturing method thereof

Manufacturing method of semiconductor device and semiconductor devi...

Semiconductor device and method of manufacturing thereof

Semiconductor device and manufacturing method

Copper pillar sidewall protection

Transient interface gradient bonding for metal bonds

Manufacturing method of semiconductor device and semiconductor devi...

Semiconductor device using EMC wafer support system and fabricating...

Manufacturing method of semiconductor device and semiconductor devi...

Semiconductor package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Wafers including patterned back side layers thereon

Electronic structures including barrier layers and/or oxidation bar...

Electronic structures including conductive layers comprising copper...

Lead free alloy bump structure and fabrication method

Electronic devices including solder bumps on compliant dielectric l...

Methods of forming electronic structures including conductive shunt...

Methods of forming back side layers for thinned wafers

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...

TRANSIENT INTERFACE GRADIENT BONDING FOR METAL BONDS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

Semiconductor Package and Manufacturing Method Thereof

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

COPPER PILLAR SIDEWALL PROTECTION

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING...

Semiconductor Package and Manufacturing Method Thereof

Electronic Structures Including Conductive Layers Comprising Copper...

Methods of Forming Back Side Layers For Thinned Wafers and Related...

Electronic Structures Including Barrier Layers and/or Oxidation Bar...

Solder Structures Including Barrier Layers with Nickel and/or Copper

Electronic Structures Including Barrier Layers Defining Lips