Günter Denifl

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Annenheim, AT

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device having a strain-inducing material embedd...
- Patent number 11,728,427
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Stefan Karner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical structure and method for fabricating the same
- Patent number 10,081,533
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE HAVING AN ELECTRODE WITH AN EMBEDDED MAT...
- Publication number 20230343871
- Publication date Oct 26, 2023
- Infineon Technologies Austria AG
- Stefan Karner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE HAVING A STRAIN-INDUCING MATERIAL EMBEDD...
- Publication number 20220406937
- Publication date Dec 22, 2022
- Stefan Karner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical Structure and Method for Fabricating the Same
- Publication number 20160031701
- Publication date Feb 4, 2016
- INFINEON TECHNOLOGIES AG
- Ulrich Schmid
- B81 - MICRO-STRUCTURAL TECHNOLOGY