Günther Weichslberger

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,789,271
- Issue date Jul 29, 2014
- AT & S Austria Technologies & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a multilayer printed circuit board, adhesion p...
- Patent number 8,685,196
- Issue date Apr 1, 2014
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing a part of a planar material layer and multilaye...
- Patent number 8,541,689
- Issue date Sep 24, 2013
- AT & S Austria Technologie & Systemtecknik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nonstick material, method for removing a part of a planar material...
- Patent number 8,388,792
- Issue date Mar 5, 2013
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...
- Publication number 20180257364
- Publication date Sep 13, 2018
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20140307403
- Publication date Oct 16, 2014
- Günther Weichslberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...
- Publication number 20140216795
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL...
- Publication number 20130149506
- Publication date Jun 13, 2013
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...
- Publication number 20110272177
- Publication date Nov 10, 2011
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...
- Publication number 20110069448
- Publication date Mar 24, 2011
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND USE AND PRINTED CI...
- Publication number 20110067908
- Publication date Mar 24, 2011
- Günther Weichslberger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYE...
- Publication number 20100059262
- Publication date Mar 11, 2010
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL...
- Publication number 20100009178
- Publication date Jan 14, 2010
- Gerald Weidinger
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Günther Weichslberger

Person

Patents Grantslast 30 patents

Method for integrating an electronic component into a printed circu...

Method for producing a multilayer printed circuit board, adhesion p...

Method for removing a part of a planar material layer and multilaye...

Nonstick material, method for removing a part of a planar material...

Patents Applicationslast 30 patents

USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...

METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...

NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL...

METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...

METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRI...

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND USE AND PRINTED CI...

METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYE...

NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL...