Gobinda Das

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Techniques for improving bond pad performance
- Patent number 8,524,596
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFI probe I/O wrap test method
- Patent number 7,007,380
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
TFI probe I/O wrap test method
- Patent number 6,731,128
- Issue date May 4, 2004
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Wafer probe interface arrangement with nonresilient probe elements...
- Patent number 6,426,636
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Off-axis contact tip and dense packing design for a fine pitch probe
- Patent number 6,411,112
- Issue date Jun 25, 2002
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Grant
Gray scale etching for thin flexible interposer
- Patent number 6,156,484
- Issue date Dec 5, 2000
- International Business Machines Corporation
- Ernest Bassous
- G01 - MEASURING TESTING
Information Patent Grant
Multi-layer ceramic substrate decoupling
- Patent number 5,973,928
- Issue date Oct 26, 1999
- International Business Machines Corporation
- Charles J. Blasi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump for a thermal compression bond and method for making same
- Patent number 5,059,553
- Issue date Oct 22, 1991
- IBM Corporation
- Erich Berndlmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump for a thermal compression bond and method for making same
- Patent number 5,053,851
- Issue date Oct 1, 1991
- International Business Machines Corp.
- Erich Berndlmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method for improved device yield by minim...
- Patent number 4,069,068
- Issue date Jan 17, 1978
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Techniques for Improving Bond Pad Performance
- Publication number 20120279767
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for improving bond pad performance
- Publication number 20060244138
- Publication date Nov 2, 2006
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TFI PROBE I/O WRAP TEST METHOD
- Publication number 20040124867
- Publication date Jul 1, 2004
- International Business Machines Corporation
- Gobinda Das
- G01 - MEASURING TESTING
Information Patent Application
TFI probe I/O wrap test method
- Publication number 20020058346
- Publication date May 16, 2002
- International Business Machines
- Gobinda Das
- G01 - MEASURING TESTING

Gobinda Das

Person

Patents Grantslast 30 patents

Techniques for improving bond pad performance

TFI probe I/O wrap test method

TFI probe I/O wrap test method

Wafer probe interface arrangement with nonresilient probe elements...

Off-axis contact tip and dense packing design for a fine pitch probe

Gray scale etching for thin flexible interposer

Multi-layer ceramic substrate decoupling

Metal bump for a thermal compression bond and method for making same

Metal bump for a thermal compression bond and method for making same

Semiconductor fabrication method for improved device yield by minim...

Patents Applicationslast 30 patents

Techniques for Improving Bond Pad Performance

Techniques for improving bond pad performance

TFI PROBE I/O WRAP TEST METHOD

TFI probe I/O wrap test method