Going Sik KIM

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a rigid-flexible printed circuit board
- Patent number 9,338,899
- Issue date May 10, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi chip package
- Patent number 8,981,549
- Issue date Mar 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hye Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 8,631,567
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160381792
- Publication date Dec 29, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo MOK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20160374198
- Publication date Dec 22, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung-Kyu KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150177621
- Publication date Jun 25, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Woo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140166355
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Suk Gi Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JIG UNIT FOR FIXING SUBSTRATE AND SUBSTRATE TRANSFER APPARATUS INCL...
- Publication number 20140105712
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sung Taek Lim
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20140096383
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140041902
- Publication date Feb 13, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20140034359
- Publication date Feb 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153280
- Publication date Jun 20, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI CHIP PACKAGE
- Publication number 20120168960
- Publication date Jul 5, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hye Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120138336
- Publication date Jun 7, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ryoichi WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20100162562
- Publication date Jul 1, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER
- Publication number 20100147563
- Publication date Jun 17, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Young Po Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board for semiconductor pac...
- Publication number 20080257742
- Publication date Oct 23, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rigid-flexible printed circuit board and method of manufacturing th...
- Publication number 20080014768
- Publication date Jan 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Going Sik KIM

Person

Patents Grantslast 30 patents

Method of manufacturing a rigid-flexible printed circuit board

Multi chip package

Method of manufacturing rigid-flexible printed circuit board

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

JIG UNIT FOR FIXING SUBSTRATE AND SUBSTRATE TRANSFER APPARATUS INCL...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTI CHIP PACKAGE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD

SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER

Method of manufacturing printed circuit board for semiconductor pac...

Rigid-flexible printed circuit board and method of manufacturing th...