Goji Shiga

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin sheet for sealing electronic device and method for manufactur...
- Patent number 10,297,470
- Issue date May 21, 2019
- Nitto Denko Corporation
- Yusaku Shimizu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Film for flip chip type semiconductor back surface and its use
- Patent number 10,211,083
- Issue date Feb 19, 2019
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing sheet with separators on both surfaces, and method for manu...
- Patent number 10,128,131
- Issue date Nov 13, 2018
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing sheet
- Patent number 10,074,582
- Issue date Sep 11, 2018
- Nitto Denko Corporation
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for back surface of flip-chip semiconductor
- Patent number 9,911,683
- Issue date Mar 6, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for sealing and method for manufacturing semiconductor device...
- Patent number 9,754,894
- Issue date Sep 5, 2017
- Nitto Denko Corporation
- Chie Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet used in manufacture of semiconductor device, adhesiv...
- Patent number 9,620,403
- Issue date Apr 11, 2017
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,478,454
- Issue date Oct 25, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,362,156
- Issue date Jun 7, 2016
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing flip-chip type semiconductor device
- Patent number 9,324,616
- Issue date Apr 26, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 9,293,387
- Issue date Mar 22, 2016
- Nitto Denko Corporation
- Yusuke Komoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for back surface of flip-chip semiconductor, dicing-tape-integ...
- Patent number 9,196,533
- Issue date Nov 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 9,074,113
- Issue date Jul 7, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface, and pro...
- Patent number 9,050,773
- Issue date Jun 9, 2015
- Nitto Denko Corporation
- Fumiteru Asai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 9,035,466
- Issue date May 19, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 8,986,486
- Issue date Mar 24, 2015
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for back surface of flip-chip semiconductor
- Patent number 8,896,134
- Issue date Nov 25, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,722,517
- Issue date May 13, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface
- Patent number 8,704,382
- Issue date Apr 22, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,698,324
- Issue date Apr 15, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,692,389
- Issue date Apr 8, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface, and pro...
- Patent number 8,679,931
- Issue date Mar 25, 2014
- Nitto Denko Corporation
- Fumiteru Asai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermally releasable sheet-integrated film for semiconductor back s...
- Patent number 8,652,938
- Issue date Feb 18, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface, and pro...
- Patent number 8,647,956
- Issue date Feb 11, 2014
- Nitto Denko Corporation
- Fumiteru Asai
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,643,194
- Issue date Feb 4, 2014
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface containing therm...
- Patent number 8,513,816
- Issue date Aug 20, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for flip chip type semiconductor back surface, dicing tape-int...
- Patent number 8,492,907
- Issue date Jul 23, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface, and pro...
- Patent number 8,455,302
- Issue date Jun 4, 2013
- Nitto Denko Corporation
- Goji Shiga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRO...
- Publication number 20180346640
- Publication date Dec 6, 2018
- Nitto Denko Corporation
- Goji SHIGA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BUMP BASE REINFORCEMENT SHEET
- Publication number 20180304603
- Publication date Oct 25, 2018
- NITTO DENKO CORPORATION
- Chie Iino
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING SHEET
- Publication number 20170287800
- Publication date Oct 5, 2017
- NITTO DENKO CORPORATION
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...
- Publication number 20170278716
- Publication date Sep 28, 2017
- NITTO DENKO CORPORATION
- Chie Iino
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20170140948
- Publication date May 18, 2017
- Nitto Denko Corporation
- Ryuichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20170125373
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...
- Publication number 20170040187
- Publication date Feb 9, 2017
- Nitto Denko Corporation
- Chie Iino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...
- Publication number 20170040287
- Publication date Feb 9, 2017
- NITTO DENKO CORPORATION
- Goji Shiga
- B32 - LAYERED PRODUCTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170032979
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...
- Publication number 20160300733
- Publication date Oct 13, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20160269000
- Publication date Sep 15, 2016
- NITTO DENKO CORPORATION
- Yusaku Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160237288
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Goji Shiga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20160211217
- Publication date Jul 21, 2016
- NITTO DENKO CORPORATION
- Chie IINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE AND METH...
- Publication number 20160172230
- Publication date Jun 16, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE SHEET USED IN MANUFACTURE OF SEMICONDUCTOR DEVICE, ADHESIV...
- Publication number 20160056066
- Publication date Feb 25, 2016
- NITTO DENKO CORPORATION
- Goji SHIGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...
- Publication number 20150162236
- Publication date Jun 11, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE
- Publication number 20140361443
- Publication date Dec 11, 2014
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140203458
- Publication date Jul 24, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20140178680
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140175677
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE INTEGRATED ADHESIVE SHEET, METHOD OF MANUFACTURING SEMI...
- Publication number 20140162434
- Publication date Jun 12, 2014
- Nitto Denko Corporation
- Goji SHIGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140159254
- Publication date Jun 12, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...
- Publication number 20140037923
- Publication date Feb 6, 2014
- Nitto Denko Corporation
- Fumiteru ASAI
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MARKING SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SE...
- Publication number 20130328217
- Publication date Dec 12, 2013
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING AND METHOD OF MANUFACT...
- Publication number 20130122688
- Publication date May 16, 2013
- NITTO DENKO CORPORATION
- Takatoshi Sasaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR
- Publication number 20130099394
- Publication date Apr 25, 2013
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEG...
- Publication number 20130095639
- Publication date Apr 18, 2013
- Nitto Denko Corporation
- Naohide Takamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-C...
- Publication number 20130017396
- Publication date Jan 17, 2013
- Nitto Denko Corporation
- Goji SHIGA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Resin sheet for sealing electronic device and method for manufactur...

Film for flip chip type semiconductor back surface and its use

Sealing sheet with separators on both surfaces, and method for manu...

Sealing sheet

Film for back surface of flip-chip semiconductor

Film for semiconductor device production, method for producing film...

Sheet for sealing and method for manufacturing semiconductor device...

Thermally curable resin sheet for sealing semiconductor chip, and m...

Adhesive sheet used in manufacture of semiconductor device, adhesiv...

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Method of manufacturing flip-chip type semiconductor device

Film for flip chip type semiconductor back surface, dicing tape-int...

Film for back surface of flip-chip semiconductor, dicing-tape-integ...

Film for flip chip type semiconductor back surface, dicing tape-int...

Dicing tape-integrated film for semiconductor back surface, and pro...

Dicing tape-integrated film for semiconductor back surface

Film for semiconductor device production, method for producing film...

Film for back surface of flip-chip semiconductor

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface, and pro...

Thermally releasable sheet-integrated film for semiconductor back s...

Dicing tape-integrated film for semiconductor back surface, and pro...

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface containing therm...

Film for flip chip type semiconductor back surface, dicing tape-int...

Dicing tape-integrated film for semiconductor back surface, and pro...

Patents Applicationslast 30 patents

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, PROCESS FOR PRO...

BUMP BASE REINFORCEMENT SHEET

SEALING SHEET

SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...

ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...

RESIN SHEET FOR SEALING ELECTRONIC DEVICE AND METHOD FOR MANUFACTUR...

SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE AND METH...

ADHESIVE SHEET USED IN MANUFACTURE OF SEMICONDUCTOR DEVICE, ADHESIV...

FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM...

METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

DICING TAPE INTEGRATED ADHESIVE SHEET, METHOD OF MANUFACTURING SEMI...

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PRO...

METHOD OF MARKING SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SE...

PRESSURE-SENSITIVE ADHESIVE SHEET FOR DICING AND METHOD OF MANUFACT...

FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR

FILM FOR BACK SURFACE OF FLIP-CHIP SEMICONDUCTOR, DICING-TAPE-INTEG...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-C...