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Gopal C. Jha
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San Diego, CA, US
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last 30 patents
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Patent Grant
Through mold via relief gutter on molded laser package (MLP) packages
Patent number
9,313,881
Issue date
Apr 12, 2016
QUALCOMM Incorporated
Christopher J. Healy
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic packaging with a variable thickness mold cap
Patent number
8,753,926
Issue date
Jun 17, 2014
QUALCOMM Incorporated
Christopher J. Healy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid multilayer substrate
Patent number
8,546,921
Issue date
Oct 1, 2013
QUALCOMM Incorporated
Vivek Ramadoss
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES
Publication number
20140196940
Publication date
Jul 17, 2014
QUALCOMM Incorporated
Christopher J. Healy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Packaging With A Variable Thickness Mold Cap
Publication number
20120061857
Publication date
Mar 15, 2012
QUALCOMM Incorporated
Vivek Ramadoss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid Multilayer Substrate
Publication number
20120049333
Publication date
Mar 1, 2012
QUALCOMM Incorporated
Vivek Ramadoss
H01 - BASIC ELECTRIC ELEMENTS