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Hong Kong, HK
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last 30 patents
Information
Patent Grant
Method for forming reinforced interconnects on a substrate
Patent number
7,494,924
Issue date
Feb 24, 2009
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming multi-layer bumps on a substrate
Patent number
7,422,973
Issue date
Sep 9, 2008
Freescale Semiconductor, Inc.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming multi-layer bumps on a substrate
Patent number
7,279,409
Issue date
Oct 9, 2007
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method for forming reinforced interconnects on a substrate
Publication number
20070207605
Publication date
Sep 6, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for forming multi-layer bumps on a substrate
Publication number
20070178688
Publication date
Aug 2, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for forming multi-layer bumps on a substrate
Publication number
20070099413
Publication date
May 3, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Lead frame panel and method of packaging semiconductor devices usin...
Publication number
20060208344
Publication date
Sep 21, 2006
Hei Ming Shiu
H01 - BASIC ELECTRIC ELEMENTS