Gordon Haller

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 12,167,600
- Issue date Dec 10, 2024
- Collin Howder
Information Patent Grant
Three dimensional memory
- Patent number 11,949,022
- Issue date Apr 2, 2024
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,903,201
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for predicting properties of structures, imager system, and...
- Patent number 11,869,178
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Amitava Majumdar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,756,826
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,690,226
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Grant
Semiconductor devices and methods of fabrication
- Patent number 11,626,424
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of elevationally-extending strings of memory cells and metho...
- Patent number 11,600,494
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,489,049
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,348,939
- Issue date May 31, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory
- Patent number 11,289,611
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 11,195,854
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 11,177,279
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,121,146
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabrication
- Patent number 11,088,168
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,088,165
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,075,215
- Issue date Jul 27, 2021
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of elevationally-extending strings of memory cells and metho...
- Patent number 11,037,797
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component guard ring
- Patent number 11,018,097
- Issue date May 25, 2021
- Intel Corporation
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical string of memory cells individually comprising a programma...
- Patent number 11,018,155
- Issue date May 25, 2021
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory component
- Patent number 11,010,058
- Issue date May 18, 2021
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 10,985,252
- Issue date Apr 20, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated structures
- Patent number 10,943,920
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for predicting properties of structures, imager system, and...
- Patent number 10,872,403
- Issue date Dec 22, 2020
- Micron Technology, Inc.
- Amitava Majumdar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 10,784,273
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Grant
Solid state memory device, and manufacturing method thereof
- Patent number 10,707,121
- Issue date Jul 7, 2020
- Intel Corporatino
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming vertically-stacked mem...
- Patent number 10,665,599
- Issue date May 26, 2020
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of elevationally-extending strings of memory cells and metho...
- Patent number 10,665,469
- Issue date May 26, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 10,658,380
- Issue date May 19, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory
- Patent number 10,651,315
- Issue date May 12, 2020
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...
- Publication number 20240153062
- Publication date May 9, 2024
- Micron Technology, Inc.
- Amitava Majumdar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20230413561
- Publication date Dec 21, 2023
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20230284451
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Collin Howder
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20220254810
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Memory
- Publication number 20220181483
- Publication date Jun 9, 2022
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20210408029
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION
- Publication number 20210366931
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210358950
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...
- Publication number 20210265171
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210193675
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210175248
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210151574
- Publication date May 20, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...
- Publication number 20210090246
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Amitava Majumdar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210066460
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200279867
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array
- Publication number 20200266204
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- Collin Howder
- G11 - INFORMATION STORAGE
Information Patent Application
Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...
- Publication number 20200251347
- Publication date Aug 6, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Memory
- Publication number 20200243677
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array
- Publication number 20200235112
- Publication date Jul 23, 2020
- Micron Technoloogy, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION
- Publication number 20200227427
- Publication date Jul 16, 2020
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical String Of Memory Cells Individually Comprising A Programma...
- Publication number 20200212065
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT GUARD RING
- Publication number 20200194385
- Publication date Jun 18, 2020
- Intel Corporation
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20200176471
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- Jie Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Fabricating Integrated Structures
- Publication number 20200152658
- Publication date May 14, 2020
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20200119036
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200119040
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...
- Publication number 20200083059
- Publication date Mar 12, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...
- Publication number 20200051235
- Publication date Feb 13, 2020
- Micron Technology, Inc.
- Amitava Majumdar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLID STATE MEMORY COMPONENT
- Publication number 20190294330
- Publication date Sep 26, 2019
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory Arrays and Methods of Fabricating Integrated Structures
- Publication number 20190280007
- Publication date Sep 12, 2019
- Micron Technology, Inc.
- John M. Meldrim
- H01 - BASIC ELECTRIC ELEMENTS

Gordon Haller

Person

Patents Grantslast 30 patents

Integrated assemblies, and methods of forming integrated assemblies

Three dimensional memory

Integrated assemblies, and methods of forming integrated assemblies

System for predicting properties of structures, imager system, and...

Forming terminations in stacked memory arrays

Integrated assemblies, and methods of forming integrated assemblies

Semiconductor devices and methods of fabrication

Arrays of elevationally-extending strings of memory cells and metho...

Integrated assemblies, and methods of forming integrated assemblies

Integrated assemblies, and methods of forming integrated assemblies

Three dimensional memory

Integrated structures and methods of forming integrated structures

Formation of termination structures in stacked memory arrays

Forming terminations in stacked memory arrays

Semiconductor devices and methods of fabrication

Integrated assemblies, and methods of forming integrated assemblies

Memory arrays and methods used in forming a memory array

Arrays of elevationally-extending strings of memory cells and metho...

Electronic component guard ring

Vertical string of memory cells individually comprising a programma...

Solid state memory component

Integrated assemblies, and methods of forming integrated assemblies

Methods of fabricating integrated structures

System for predicting properties of structures, imager system, and...

Memory arrays and methods used in forming a memory array

Solid state memory device, and manufacturing method thereof

Integrated structures and methods of forming vertically-stacked mem...

Arrays of elevationally-extending strings of memory cells and metho...

Formation of termination structures in stacked memory arrays

Three dimensional memory

Patents Applicationslast 30 patents

SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Three Dimensional Memory

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

Integrated Assemblies, and Methods of Forming Integrated Assemblies

SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

Memory Arrays And Methods Used In Forming A Memory Array

Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...

Three Dimensional Memory

Memory Arrays And Methods Used In Forming A Memory Array

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION

Vertical String Of Memory Cells Individually Comprising A Programma...

ELECTRONIC COMPONENT GUARD RING

Integrated Structures and Methods of Forming Integrated Structures

Methods of Fabricating Integrated Structures

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

Arrays Of Elevationally-Extending Strings Of Memory Cells And Metho...

SYSTEM FOR PREDICTING PROPERTIES OF STRUCTURES, IMAGER SYSTEM, AND...

SOLID STATE MEMORY COMPONENT

Memory Arrays and Methods of Fabricating Integrated Structures