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Goro Izuta
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and semiconductor assembly module with a gap-c...
Patent number
7,361,983
Issue date
Apr 22, 2008
Mitsubishi Denki Kabushiki Kaisha
Kenichi Hayashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder supplying method, solder supplying apparatus and soldering m...
Patent number
5,950,908
Issue date
Sep 14, 1999
Mitsubishi Denki Kabushiki Kaisha
Junji Fujino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, production method therefor, method for testin...
Patent number
5,821,762
Issue date
Oct 13, 1998
Mitsubishi Denki Kabushiki Kaisha
Tsuneo Hamaguchi
G01 - MEASURING TESTING
Information
Patent Grant
Solder material, junctioning method, junction material, and semicon...
Patent number
5,609,287
Issue date
Mar 11, 1997
Mitsubishi Denki Kabushiki Kaisha
Goro Izuta
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Semiconductor device and semiconductor assembly module
Publication number
20040145043
Publication date
Jul 29, 2004
Mitsubishi Denki Kabushiki Kaisha
Kenichi Hayashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR