Gorou Ikegami

Person

Ohtsu-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component and fabrication method thereof
- Patent number 6,794,762
- Issue date Sep 21, 2004
- NEC Electronics Corporation
- Gorou Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having dispersed filler between electrodes
- Patent number 6,674,178
- Issue date Jan 6, 2004
- NEC Electronics Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor pellet having bump e...
- Patent number 6,670,706
- Issue date Dec 30, 2003
- NEC Corporation
- Gorou Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip type semiconductor device having split voids within under...
- Patent number 6,653,171
- Issue date Nov 25, 2003
- NEC Electronics Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and flat electrodes
- Patent number 6,617,688
- Issue date Sep 9, 2003
- NEC Electronics Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable chip type semiconductor device and manufacturing...
- Patent number 6,608,372
- Issue date Aug 19, 2003
- NEC Electronics Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reliable coupling between wiring substr...
- Patent number 6,504,240
- Issue date Jan 7, 2003
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a semiconductor with bump electrodes
- Patent number 6,433,426
- Issue date Aug 13, 2002
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device with bump electrodes
- Patent number 6,406,989
- Issue date Jun 18, 2002
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,194,781
- Issue date Feb 27, 2001
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip type semiconductor device having recessed-protruded elect...
- Patent number 6,137,184
- Issue date Oct 24, 2000
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package featuring thin semiconductor substrate and li...
- Publication number 20070194457
- Publication date Aug 23, 2007
- NEC ELECTRONICS COROPORATION
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and fabrication method thereof
- Publication number 20030160339
- Publication date Aug 28, 2003
- NEC ELECTRONICS CORPORATION
- Gorou Ikegami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multiple wiring board
- Publication number 20030104184
- Publication date Jun 5, 2003
- NEC ELECTRONICS CORPORATION
- Taro Hirai
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring substrate for small electronic component and manufacturing m...
- Publication number 20030058629
- Publication date Mar 27, 2003
- Taro Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board having plating conductive layer with bumps an...
- Publication number 20030036220
- Publication date Feb 20, 2003
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having flat electrodes of a first semiconducto...
- Publication number 20020140066
- Publication date Oct 3, 2002
- Fuji Photo Optical Co., Ltd.
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mountable chip type semiconductor device and manufacturing...
- Publication number 20020117762
- Publication date Aug 29, 2002
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including a semiconductor pellet having bump e...
- Publication number 20020089057
- Publication date Jul 11, 2002
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-type semiconductor device
- Publication number 20020048905
- Publication date Apr 25, 2002
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip type semiconductor device having split voids within under...
- Publication number 20020048848
- Publication date Apr 25, 2002
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having reliable electrical connection
- Publication number 20010026015
- Publication date Oct 4, 2001
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODE...
- Publication number 20010013652
- Publication date Aug 16, 2001
- SHIGEHARU HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having reliable coupling between wiring substr...
- Publication number 20010004536
- Publication date Jun 21, 2001
- NEC Corporation
- Gorou Ikegami
- H01 - BASIC ELECTRIC ELEMENTS

Gorou Ikegami

Person

Patents Grantslast 30 patents

Electronic component and fabrication method thereof

Semiconductor device having dispersed filler between electrodes

Semiconductor device including a semiconductor pellet having bump e...

Flip-chip type semiconductor device having split voids within under...

Semiconductor device and flat electrodes

Surface mountable chip type semiconductor device and manufacturing...

Semiconductor device having reliable coupling between wiring substr...

Semiconductor device having a semiconductor with bump electrodes

Method of fabricating semiconductor device with bump electrodes

Semiconductor device and method of fabricating the same

Flip-chip type semiconductor device having recessed-protruded elect...

Patents Applicationslast 30 patents

Semiconductor package featuring thin semiconductor substrate and li...

Electronic component and fabrication method thereof

Multiple wiring board

Wiring substrate for small electronic component and manufacturing m...

Printed circuit board having plating conductive layer with bumps an...

Semiconductor device having flat electrodes of a first semiconducto...

Surface mountable chip type semiconductor device and manufacturing...

Semiconductor device including a semiconductor pellet having bump e...

Chip-type semiconductor device

Flip-chip type semiconductor device having split voids within under...

Semiconductor device having reliable electrical connection

SEMICONDUCTOR DEVICE FREE FROM SHORT-CIRCUIT BETWEEN BUMP ELECTRODE...

Semiconductor device having reliable coupling between wiring substr...