Gosei Uemura

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thin adhesive sheet for working semiconductor wafers
- Patent number 6,010,782
- Issue date Jan 4, 2000
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for working a semiconductor wafer
- Patent number 5,714,029
- Issue date Feb 3, 1998
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thin adhesive sheet for working semiconductor wafers
- Patent number 5,637,395
- Issue date Jun 10, 1997
- Nitto Electric Industrial Co., Ltd.
- Gosei Uemura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composite tubular article and process for producing the same
- Patent number 5,411,779
- Issue date May 2, 1995
- Nitto Denko Corporation
- Toshio Nakajima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for producing a multilayered ceramic structure using an adh...
- Patent number 5,089,071
- Issue date Feb 18, 1992
- Nitto Electrical Industrial
- Takashi Tominaga
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES