Gottfried Beer

Person

Nittendorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 11,322,451
- Issue date May 3, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,957,671
- Issue date Mar 23, 2021
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical ferrite antenna including pre-fabricated connection members
- Patent number 10,651,898
- Issue date May 12, 2020
- Infineon Technologies AG
- Walther Pachler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,643,971
- Issue date May 5, 2020
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate package of chip on carrier and in cavity
- Patent number 10,522,433
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Juergen Hoegerl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,438,926
- Issue date Oct 8, 2019
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device having a sense resistor in a re-distribution...
- Patent number 10,295,570
- Issue date May 21, 2019
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-acoustic gas sensor module having light emitter and detector...
- Patent number 10,241,088
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 10,211,158
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an inductor core for a chip assembly and ch...
- Patent number 10,102,967
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a dense arrangement of contact terminals
- Patent number 10,090,251
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip packages and methods for manufacturing an embedded ch...
- Patent number 10,008,470
- Issue date Jun 26, 2018
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a number of chip assemblies and method for pro...
- Patent number 9,984,928
- Issue date May 29, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated die
- Patent number 9,978,720
- Issue date May 22, 2018
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip under package
- Patent number 9,859,251
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a number of chip as...
- Patent number 9,818,730
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip packages and methods for manufacturing an embedded ch...
- Patent number 9,721,920
- Issue date Aug 1, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package arrangement including external block comprising semiconduct...
- Patent number 9,711,462
- Issue date Jul 18, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging
- Patent number 9,620,457
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Ulrich Wachter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,620,459
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a number of chip as...
- Patent number 9,589,859
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,559,065
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensor device
- Patent number 9,553,208
- Issue date Jan 24, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solderable and bondable electrical cont...
- Patent number 9,496,237
- Issue date Nov 15, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip RF shields with backside redistribution lines
- Patent number 9,390,973
- Issue date Jul 12, 2016
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card module, smart card body, smart card and smart card produ...
- Patent number 9,384,437
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor component with moisture barrier for sealing semicondu...
- Patent number 9,337,155
- Issue date May 10, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, chip package and die
- Patent number 9,331,059
- Issue date May 3, 2016
- Infineon Technologies AG
- Robert Allinger
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a semiconductor device with encapsulant
- Patent number 9,287,206
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising two semiconductor modules and late...
- Patent number 9,196,510
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200303340
- Publication date Sep 24, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200013751
- Publication date Jan 9, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20190221521
- Publication date Jul 18, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate package of chip on carrier and in cavity
- Publication number 20170316994
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CH...
- Publication number 20170288176
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Number of Chip Assemblies and Method for Pro...
- Publication number 20170098580
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Having a Dense Arrangement of Contact Terminals
- Publication number 20170025357
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Peter Ossimitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated die
- Publication number 20170011982
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Horst THEUSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL FERRITE ANTENNA INCLUDING PRE-FABRICATED CONNECTION MEMBERS
- Publication number 20170012355
- Publication date Jan 12, 2017
- INFINEON TECHNOLOGIES AG
- Walther Pachler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector...
- Publication number 20160313288
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device Having a Chip Under Package
- Publication number 20160225745
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20160126192
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR DEVICE HAVING A SENSE RESISTOR IN A RE-DISTRIBUTION...
- Publication number 20160084887
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device Having Solderable and Bondable Electrical Cont...
- Publication number 20150333023
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card module, smart card body, smart card and smart card produ...
- Publication number 20150317553
- Publication date Nov 5, 2015
- INFINEON TECHNOLOGIES AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of manufacturing an inductor core for a chip assembly and ch...
- Publication number 20150170835
- Publication date Jun 18, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CHIP PACKAGE AND DIE
- Publication number 20150162318
- Publication date Jun 11, 2015
- INFINEON TECHNOLOGIES AG
- Robert Allinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packaging
- Publication number 20150145149
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising Two Semiconductor Modules and Late...
- Publication number 20150130048
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current Sensor Device
- Publication number 20150076636
- Publication date Mar 19, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Arrangement, Method for Producing a Semiconductor Mod...
- Publication number 20150061144
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150064846
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Number of Chip As...
- Publication number 20150061100
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Number of Chip As...
- Publication number 20150054166
- Publication date Feb 26, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and a Method for Fabrication Thereof By Extend...
- Publication number 20150054159
- Publication date Feb 26, 2015
- INFINEON TECHNOLOGIES AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip RF Shields with Backside Redistribution Lines
- Publication number 20150024591
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME
- Publication number 20140332936
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Measurement Based Circuit Wiring Layout Modification Met...
- Publication number 20140310671
- Publication date Oct 16, 2014
- Gottfried Beer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Component, Semiconductor Module and Methods for Produ...
- Publication number 20140284624
- Publication date Sep 25, 2014
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239438
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Thomas Kilger
- H01 - BASIC ELECTRIC ELEMENTS

Gottfried Beer

Person

Patents Grantslast 30 patents

Power semiconductor module having a direct copper bonded substrate...

Method for fabricating a semiconductor and semiconductor package

Vertical ferrite antenna including pre-fabricated connection members

Method for fabricating a semiconductor and semiconductor package

Laminate package of chip on carrier and in cavity

Method for fabricating a semiconductor and semiconductor package

Current sensor device having a sense resistor in a re-distribution...

Photo-acoustic gas sensor module having light emitter and detector...

Power semiconductor module having a direct copper bonded substrate...

Method of manufacturing an inductor core for a chip assembly and ch...

Semiconductor chip having a dense arrangement of contact terminals

Embedded chip packages and methods for manufacturing an embedded ch...

Method for producing a number of chip assemblies and method for pro...

Insulated die

Semiconductor device having a chip under package

Semiconductor arrangement, method for producing a number of chip as...

Embedded chip packages and methods for manufacturing an embedded ch...

Package arrangement including external block comprising semiconduct...

Semiconductor device packaging

Semiconductor arrangement, method for producing a semiconductor mod...

Semiconductor arrangement, method for producing a number of chip as...

Semiconductor arrangement, method for producing a semiconductor mod...

Current sensor device

Semiconductor device having solderable and bondable electrical cont...

On-chip RF shields with backside redistribution lines

Smart card module, smart card body, smart card and smart card produ...

Semiconductor component with moisture barrier for sealing semicondu...

Chip, chip package and die

Method of fabricating a semiconductor device with encapsulant

Semiconductor package comprising two semiconductor modules and late...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

Laminate package of chip on carrier and in cavity

EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CH...

Method for Producing a Number of Chip Assemblies and Method for Pro...

Semiconductor Chip Having a Dense Arrangement of Contact Terminals

Insulated die

VERTICAL FERRITE ANTENNA INCLUDING PRE-FABRICATED CONNECTION MEMBERS

Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector...

Semiconductor Device Having a Chip Under Package

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

CURRENT SENSOR DEVICE HAVING A SENSE RESISTOR IN A RE-DISTRIBUTION...

Semiconductor Device Having Solderable and Bondable Electrical Cont...

Smart card module, smart card body, smart card and smart card produ...

Method of manufacturing an inductor core for a chip assembly and ch...

CHIP, CHIP PACKAGE AND DIE

Semiconductor Device Packaging

Semiconductor Package Comprising Two Semiconductor Modules and Late...

Current Sensor Device

Semiconductor Arrangement, Method for Producing a Semiconductor Mod...

Semiconductor Device

Semiconductor Arrangement, Method for Producing a Number of Chip As...

Semiconductor Arrangement, Method for Producing a Number of Chip As...

Semiconductor Module and a Method for Fabrication Thereof By Extend...

On-Chip RF Shields with Backside Redistribution Lines

PACKAGE ARRANGEMENT AND METHOD OF FORMING THE SAME

Electrical Measurement Based Circuit Wiring Layout Modification Met...

Semiconductor Component, Semiconductor Module and Methods for Produ...

SEMICONDUCTOR DEVICE