Gotthard Jungnickel

Person

Radeberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming bump structures that include a protection layer
- Patent number 8,580,672
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization with superior adhesion in high-performance...
- Patent number 8,384,218
- Issue date Feb 26, 2013
- GLOBALFOUNDRIES Inc.
- Soeren Zenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming solder balls with a stable oxide layer by contro...
- Patent number 7,829,453
- Issue date Nov 9, 2010
- GLOBALFOUNDRIES Inc.
- Gotthard Jungnickel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for efficiently patterning an underbump metallization lay...
- Patent number 7,585,759
- Issue date Sep 8, 2009
- Advanced Micro Devices, Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming a copper-based contact layer without a termin...
- Patent number 7,569,937
- Issue date Aug 4, 2009
- Advanced Micro Devices, Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient method of forming and assembling a microelectronic chip i...
- Patent number 7,491,556
- Issue date Feb 17, 2009
- Advanced Micro Devices, Inc.
- Gotthard Jungnickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a substrate contact in a field effect transistor...
- Patent number 6,720,242
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Gert Burbach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROT...
- Publication number 20140021604
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Bump Structures That Include a Protection Layer
- Publication number 20130099372
- Publication date Apr 25, 2013
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer...
- Publication number 20120052677
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Soeren Zenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK SIDE METALLIZATION WITH SUPERIOR ADHESION IN HIGH-PERFORMANCE...
- Publication number 20110074031
- Publication date Mar 31, 2011
- Soeren Zenner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20080203571
- Publication date Aug 28, 2008
- Gotthard Jungnickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
- Publication number 20080099913
- Publication date May 1, 2008
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTRO...
- Publication number 20070123020
- Publication date May 31, 2007
- Gotthard Jungnickel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...
- Publication number 20070023928
- Publication date Feb 1, 2007
- FRANK KUECHENMEISTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FORMING A COPPER-BASED CONTACT LAYER WITHOUT A TERMIN...
- Publication number 20070023918
- Publication date Feb 1, 2007
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Efficient method of forming and assembling a microelectronic chip i...
- Publication number 20060172444
- Publication date Aug 3, 2006
- Gotthard Jungnickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a substrate contact in a field effect transistor...
- Publication number 20020055244
- Publication date May 9, 2002
- Gert Burbach
- H01 - BASIC ELECTRIC ELEMENTS

Gotthard Jungnickel

Person

Patents Grantslast 30 patents

Methods of forming bump structures that include a protection layer

Back side metallization with superior adhesion in high-performance...

Method for forming solder balls with a stable oxide layer by contro...

Technique for efficiently patterning an underbump metallization lay...

Technique for forming a copper-based contact layer without a termin...

Efficient method of forming and assembling a microelectronic chip i...

Method of forming a substrate contact in a field effect transistor...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROT...

Methods of Forming Bump Structures That Include a Protection Layer

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer...

BACK SIDE METALLIZATION WITH SUPERIOR ADHESION IN HIGH-PERFORMANCE...

BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

METHOD FOR FORMING SOLDER BALLS WITH A STABLE OXIDE LAYER BY CONTRO...

TECHNIQUE FOR EFFICIENTLY PATTERNING AN UNDERBUMP METALLIZATION LAY...

TECHNIQUE FOR FORMING A COPPER-BASED CONTACT LAYER WITHOUT A TERMIN...

Efficient method of forming and assembling a microelectronic chip i...

Method of forming a substrate contact in a field effect transistor...